Product Pathfinding Engineer - HIG-TPG
Micron TechnologyJob Title
Product Pathfinding Engineer - HIG-TPG
Role Summary
Product Pathfinding Engineer on the High Bandwidth Memory (HBM) team responsible for developing JEDEC-HBM and alternative near-memory DRAM solutions and enabling 2.5D/3D HBM implementations from electrical and packaging viewpoints. Acts as the primary interface between R&D, Manufacturing, Test, Marketing, and Quality to drive product readiness.
Work focuses on front-end and back-end integration, qualification, debugging, and reducing power per bit for ML/AI customers.
Experience Level
Mid-level. The posting emphasizes prior industry experience in HBM or equivalent high-speed memory/semiconductor work but does not specify a years-of-experience range.
Responsibilities
Core responsibilities include cross-functional product development, test planning, and build readiness for next-generation HBM products.
- Collaborate with customers, test, TD, and manufacturing to capture requirements and findings for next-generation products.
- Coordinate with Product Engineering groups (System Engineering, Component Validation, Media Health) to plan for technology node changes and alpha product test coverage.
- Drive resolution of silicon findings within expected timelines for assigned designs.
- Partner with Build, Verification, Product Architecture, System Compatibility, and Silicon Strategy teams to deliver products efficiently.
- Identify and lead build-readiness improvement initiatives to accelerate implementation of lessons learned.
- Align build readiness and execution with product leadership strategy and timelines.
Requirements
Must-have skills and behaviors required to perform the role; preferred items listed separately.
- Industry experience in high-speed datapath design, logic development, and advanced circuit analysis.
- Strong analytical, debugging, and problem-solving skills for complex technical challenges.
- Proven track record of delivering high-quality results and driving technical excellence.
- Experience collaborating across multi-functional and geographically distributed teams.
- Excellent communication, presentation, and interpersonal skills with the ability to influence partners.
- Preferred: demonstrated technical leadership and ability to guide projects and influence engineering decisions.
- Preferred: familiarity with DRAM architecture, design, and related semiconductor technologies.
- Preferred: understanding of how product yield, quality, and manufacturing efficiency affect business performance.
Education Requirements
The posting references a strong foundation in Electrical or Computer Engineering (fields of study). No specific degree level (e.g., Bachelor's, Master's, PhD) or certifications are explicitly required or stated in the listing.
About the Company
Company: Micron Technology
Headquarters: Boise, Idaho, USA
Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.
