Process Integration, Yield and Defect Reduction Engineering Lead
Intel CorporationJob Title
Process Integration, Yield and Defect Reduction Engineering Lead
Role Summary
Lead a Process Integration team supporting advanced packaging high-volume manufacturing (HVM) in Albuquerque. Collaborate with HVM engineering and factory operations to transfer, ramp, and sustain advanced packaging technologies while driving yield, quality, reliability, and manufacturing efficiency.
Experience Level
Senior — the posting specifies 5+ years of semiconductor or advanced packaging experience and leadership experience managing technical activities and manufacturing ramps.
Responsibilities
Primary responsibilities include technical leadership, cross-functional coordination, and continuous yield and defect improvement.
- Lead teams of technical contributors to support process transfers, ramps, and sustainment for advanced packaging.
- Drive yield improvement and defect reduction through data analysis, root-cause investigations, and corrective actions.
- Collaborate with factory operations and customers to meet manufacturing and delivery commitments.
- Apply statistical methods and DOE to optimize processes and control variability.
- Develop inline monitoring systems, dashboards, and manufacturing health metrics.
- Manage projects, stakeholder communication, and cross-functional technical decisions.
Requirements
Must-have technical skills and experience; preferred items listed separately.
- 5+ years of experience in semiconductor manufacturing or advanced packaging, including process integration or defect reduction.
- Experience in process integration or defect reduction for backend interconnect or advanced packaging processes (specified as 5+ years).
- Experience applying Design of Experiments (DOE) methodologies (specified as 3+ years).
- Experience with data analysis and statistical process control using tools such as JMP, SQL, PCS, or similar platforms.
- Demonstrated ability to lead technology transfer, ramp activities, and cross-functional teams.
- Strong problem solving, project management, and stakeholder communication skills.
- Preferred: experience with FMEA, process capability analysis, specification management, and developing monitoring dashboards.
Education Requirements
Bachelor's or Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, Materials Science, Microelectronics Engineering, Chemistry, Physics, or a related technical field.
About the Company
Company: Intel Corporation
Headquarters: Santa Clara, California, USA
Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.
