Process Integration Lead - IJOP

Job Title

Process Integration Lead - IJOP

Role Summary

Lead day-to-day Process Integration (PI) execution for assigned DRAM modules within Advanced Technology & Engineering. Own yield ramp, stability, and integration readiness through technology transfer, pilot, and early high-volume manufacture (HVM) phases.

The role manages a team of PI engineers, coordinates cross-functional resolution of yield and quality issues, and supports technology transfer and new product introduction in a fab environment.

Experience Level

Senior — lead-level role. The posting expects multiple years of fabrication and HVM experience (see Requirements for details).

Responsibilities

Primary responsibilities focus on PI execution, technology transfer, people leadership, and cross-functional alignment to achieve ramp and quality targets.

• Lead Process Integration execution and readiness for assigned DRAM modules during technology transfer, pilot, and early HVM.
• Own yield ramp, stability, process window margin, manufacturability, and reliability for assigned scope.
• Drive root-cause investigations for top yield detractors using DOE, SPC/FDC, FMEA, 8D, and structured problem solving.
• Champion Best-Known Methods (BKM), site-to-site learning, and sustainment of process controls.
• Execute DRAM technology transfer activities and support NPI, process qualification, and customer ramp readiness; support extended international assignments as required.
• Manage, mentor, and develop a team of PI engineers; set priorities and conduct performance feedback.
• Serve as PI interface with Manufacturing, Equipment, Yield, Device, TD, Quality, and Design to drive rapid issue resolution.
• Ensure compliance with quality, safety, and audit requirements and support off-shift/flexible schedules during critical ramps.

Requirements

Must-have technical skills and experience required to perform the role.

• 5+ years HVM or fab experience, with direct experience in yield ramp, cost reduction, and quality improvement (minimum 3 years in semiconductor fabrication contexts).
• Proven experience driving root-cause analysis and yield improvement using DOE, SPC/FDC, FMEA, 8D, and structured problem solving.
• Clear understanding of transistor operations, scaling limitations, and reliability considerations.
• Basic knowledge of CMOS processes and characterization methods.
• Experience leading or managing engineers, providing technical guidance and execution rigor.
• Experience with DRAM technology transfer, module ownership, NPI, process qualification, and ramp support.
• Ability to use data and analytics for fact-based decisions and continuous improvement; strong analytical and communication skills.

Nice-to-have:

• Experience in 300mm semiconductor environments and SWR/process transfer tools.
• Experience with TD, Process Integration, Device and Yield analysis.

Education Requirements

Minimum: Bachelor's degree (field not specified in snippet) required per posting. Preferred: Master's or Ph.D. in Materials Science, Electrical, Electronics, Chemical, or other engineering disciplines. (The posting lists degree expectations explicitly: Bachelor's required; Master's/Ph.D. preferred.)

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.