Process Integration Engineer, APTD

Job Title

Process Integration Engineer, APTD

Role Summary

Develop and integrate semiconductor process flows and packaging technologies for next-generation memory products within the Advanced Packaging Technology Development (APTD) team. Lead technical programs from concept through manufacturing transfer while working cross-functionally to balance performance, yield, reliability, manufacturability, and cost.

Experience Level

Mid-level. Typical experience expectations: Bachelor's degree +4 years, Master's degree +2 years, or PhD (see Education Requirements).

Responsibilities

Key responsibilities include leading integration projects, designing experiments, and driving data-driven solutions across development and manufacturing.

• Lead process integration projects for new technology development programs.
• Collaborate with process development, device engineering, package design, reliability, and manufacturing to resolve integration challenges.
• Design, implement, and analyze experiments (DoE) to improve process performance, yield, variability, and reliability.
• Analyze metrology, defect, parametric, probe, reliability, and test data to identify yield limiters and root causes.
• Drive corrective actions from root-cause identification through implementation and validation.
• Develop and optimize integration flows that meet performance, manufacturability, quality, reliability, cost, and schedule requirements.
• Support technology qualification, manufacturing transfer, and development activities across multiple sites.
• Apply AI-enabled tools and statistical analysis to accelerate problem solving and decision-making.

Requirements

Must-have technical skills and experience:

• Hands-on experience in process integration, process development, or device development, including experiment design, execution, and analysis.
• Knowledge of semiconductor process integration and memory technologies (DRAM, NAND, or emerging memory architectures).
• Experience using JMP or similar statistical analysis tools to inform engineering decisions.
• Demonstrated ability to solve complex technical problems using data-driven methods, statistical analysis, DoE, and root-cause investigation.

Nice-to-have:

• Experience with advanced packaging technologies (wafer-level packaging, fan-out, 2.5D/3D integration, TSV, bonding, chiplet integration).
• Experience supporting qualification and transfer into high-volume manufacturing.
• Experience developing statistical models, correlation studies, and yield analyses.
• Experience applying AI or machine learning tools to engineering workflows and yield improvement.

Education Requirements

Bachelor's degree in Electrical Engineering, Chemical Engineering, Materials Science, Physics, Mechanical Engineering, or a related field with 4+ years of semiconductor industry experience; OR Master's degree with 2+ years of semiconductor experience; OR PhD in a related field.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.