Process Integration Engineer, APTD

Job Title

Process Integration Engineer, APTD

Role Summary

As a Process Integration Engineer in Advanced Packaging Technology Development (APTD), you will develop and integrate semiconductor process flows for wafer-level and reconstructed-substrate packaging used in next-generation memory products. The role leads technical projects, resolves integration and manufacturability challenges, and coordinates across device, package, materials, reliability, and manufacturing teams.

Hands-on problem solving, experiment-driven development, and use of data/AI tools to improve engineering workflows are central to the position.

Experience Level

Mid-level. Typical experience expectations: BS +5 years semiconductor experience; MS +4 years; PhD +2 years.

Responsibilities

Primary responsibilities include leading integration projects, designing experiments, analyzing data, and partnering across functions to qualify new technologies.

• Lead technical integration projects for new memory and advanced packaging technologies.
• Design, execute, and analyze experiments to assess process performance, variability, reliability, and yield.
• Investigate and resolve integration issues using inline, defect, parametric, probe, reliability, and package-level data.
• Collaborate with Process Development, Device Engineering, Package Design, Product Engineering, Reliability, Materials, and Manufacturing to develop and transfer technologies.
• Apply AI and data tools to analysis, experiment planning, documentation, and technical problem-solving.

Requirements

Must-have technical skills and experience; preferred items listed separately.

• Proven experience delivering technical results in process integration, process development, or device development, including experiment design and analysis.
• Knowledge of semiconductor process integration and memory technologies (DRAM, NAND, or emerging memory architectures).
• Experience with data-driven methods such as statistical analysis, Design of Experiments (DoE), and root-cause analysis.
• Experience leading technical projects and collaborating across functions; ability to communicate complex technical information.
• Experience using AI tools to improve technical workflows and decision-making.

Nice-to-have:

• Experience with advanced packaging (wafer-level packaging, fan-out, 2.5D/3D integration, TSVs, microbumps, bonding, or chiplet integration).
• Experience with wafer-level technology or reconstituted wafer flows (die shift, warpage, thickness/TTV, edge integrity, defectivity, handling).
• Experience qualifying and transferring processes to high-volume manufacturing and multi-site development.
• Experience with device or package reliability and test methodologies (probe, final test, burn-in, stress testing, reliability qualification).
• Experience applying machine-learning tools for anomaly detection, yield improvement, or engineering data analysis.

Education Requirements

BS in Electrical, Chemical, or Mechanical Engineering; Materials Science & Engineering; Physics; or a related technical field (typically with 5+ years semiconductor experience); or MS in a related field (typically with 4+ years); or PhD (typically with 2+ years). Equivalent practical experience considered.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.