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Process Integration Development Manager

Intel Corporation
May 03, 2026
Full-time
Remote friendly (Phoenix, Arizona, United States)
Worldwide
$180,770 - $255,200 USD yearly
Process Engineering Jobs, Level - Senior

Job Title

Process Integration Development Manager

Role Summary

Lead a team of process integration and yield development engineers to define and qualify integrated process solutions that meet quality, yield, and output targets for advanced and mature semiconductor technologies. The role focuses on enabling technology transition from development to high-volume manufacturing and improving yield ramp efficiency across products and customers.

This position is within Intel Foundry Technology Manufacturing (MDCE/FSM) and requires collaboration with global technology teams, data-driven decision making, and cross-functional stakeholder engagement.

Experience Level

Senior. Typical experience: 9+ years in advanced semiconductor process integration; or 6+ years with a Master’s degree; or 4+ years with a PhD.

Responsibilities

Primary responsibilities include driving yield improvement, process integration, and team execution.

  • Manage and coach engineers to execute yield roadmaps and meet performance targets.
  • Transition new technologies from development to production in collaboration with global TD teams.
  • Develop and deploy tools, methodologies, and algorithms for inline and offline yield and defect analysis.
  • Perform root-cause analysis for yield and performance issues and propose mitigation plans.
  • Innovate inline monitoring and detection techniques to identify potential end-of-line failures.
  • Set yield targets aligned with technology maturity and maintain defect analytics baselines.
  • Drive process simplification and cost-reduction while maintaining quality and operational excellence.
  • Partner with internal and external customers to meet product specifications and technology requirements.
  • Define long-term process integration and yield engineering strategies for future growth.
  • Foster an inclusive, collaborative work environment and model company expectations.

Requirements

Must-have technical skills, experience, and leadership capabilities. Preferred items are noted.

  • 9+ years experience in advanced semiconductor process integration and yield improvement methodologies.
  • Proven use of statistical tools and data-driven methods to drive process improvements and yield decisions.
  • Proficiency with semiconductor process technologies: lithography, etch, CMP, thin films, and metrology.
  • Experience developing tools and methodologies for inline/offline yield and defect analysis.
  • Strong root-cause analysis skills and ability to deliver actionable mitigation plans on schedule.
  • Experience managing, coaching, and developing engineering teams to meet technical and strategic objectives.
  • Demonstrated problem-solving and project management skills; ability to prioritize in a matrixed environment.
  • Nice-to-have: deep understanding of device physics, failure modes, and high-volume manufacturing processes; experience working with external customers in a foundry environment.

Education Requirements

Required: Bachelor's degree in Electrical Engineering, Physics, Materials Science, or a related engineering/science discipline. Experience guidance: 9+ years total experience; alternatives include 6+ years with a Master's degree or 4+ years with a PhD. Preferred: PhD in Electrical Engineering, Physics, Materials Science, or related field.


About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.

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Date Posted: 2026-04-30