Engineer I - Packaging
MicrochipJob Title
Engineer I - Packaging
Role Summary
Entry-level packaging engineer role based at Microchip's Chandler site. The role supports semiconductor package development, characterization, and manufacturing support.
The position works with cross-functional teams (design, test, and manufacturing) to execute experiments, collect and analyze data, and document results for package validation.
Experience Level
Entry-level. No specific years-of-experience guidance provided in the source.
Responsibilities
Primary responsibilities are not detailed in the source. Typical responsibilities for this role include:
- Support package design, assembly, and test activities in lab and production environments.
- Execute test plans, perform measurements, and record data for package characterization and reliability studies.
- Analyze test results and prepare technical reports and documentation.
- Work with manufacturing and test teams to resolve process or quality issues and support root-cause analysis.
- Maintain laboratory equipment and adhere to safety and quality procedures.
Requirements
The source does not list explicit requirements. Typical expectations are summarized below.
- Must-have (typical): Basic engineering fundamentals, hands-on lab/test skills, ability to collect and analyze data, attention to detail, and effective oral/written communication.
- Nice-to-have: Experience or coursework related to semiconductor packaging, materials, reliability testing, soldering/assembly processes, CAD/EDA tools, or statistical data analysis.
Education Requirements
Not specified.
About the Company
Company: Microchip
Headquarters: Chandler, Arizona, USA
Microchip is a leading semiconductor company focused on developing innovative solutions to enhance the human experience. With a commitment to empowering innovation, Microchip prioritizes the value of its employees by fostering a culture that supports their growth and contributions.
