Job Title
Process Development Engineer
Role Summary
The Process Development Engineer will develop and optimize SMT, semiconductor packaging, and advanced assembly processes to support volume production and New Product Introduction (NPI). The role works with manufacturing, engineering, and vendors to improve process capability, yield, and manufacturability for RF and power semiconductor products.
Experience Level
Mid-level. Expect approximately 2+ years of relevant industry experience or equivalent practical experience.
Responsibilities
Primary responsibilities include process development, production support, and continuous improvement for semiconductor assembly and SMT operations.
- Develop and optimize SMT, flip-chip attach, die attach, and advanced packaging assembly processes.
- Support volume production and New Product Introduction (NPI) manufacturing.
- Lead process characterization, design of experiments (DOE), and process window development.
- Evaluate and qualify new equipment, materials, and process flows.
- Monitor product yields daily and coordinate corrective actions with cross-functional teams.
- Generate post-build/DFM reports and maintain process documentation, work instructions, control plans, and manufacturing standards.
- Work with fixturing vendors to design and support assembly fixtures for factory use.
- Mentor technicians and operators on process control and best practices; lead 5S and process improvement initiatives.
Requirements
Must-have technical skills and manufacturing experience, plus preferred skills.
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Must-have: Proven semiconductor assembly experience with high-density fine-pitch components (BGA, LGA, QFN, 0201, 01005, etc.).
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Must-have: Hands-on experience with process characterization, DOE execution, and establishing process windows.
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Must-have: Practical experience supporting SMT operations, flip-chip and die-attach processes in a production environment.
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Preferred: Experience with reflow, pick-and-place, and solder paste printing equipment and processes.
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Preferred: Experience with SPC techniques, Lean practices, and working in mid- to high-volume manufacturing.
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Preferred: Familiarity with IPC-A-610 acceptance standards.
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Preferred skills: Technical leadership, project management, strong communication, and cross-functional collaboration.
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Employment restriction: This position is not eligible for visa sponsorship by the company.
Education Requirements
Bachelor's degree in Mechanical, Electrical, Manufacturing, Materials engineering or a related discipline is expected; a Master's degree is preferred. The posting also states a postgraduate degree may be accepted in lieu of the 2+ years of industry experience. Relevant industry internships are noted as desirable.
About the Company
Company: Qorvo
Headquarters: Greensboro, NC, US
Qorvo supplies innovative semiconductor solutions that enhance connectivity and power for a variety of applications, including consumer electronics, automotive, and healthcare. With a focus on RF and power solutions, Qorvo combines technology leadership and global manufacturing to address complex challenges in fast-growing industries. Their commitment to excellence and innovation drives them to shape the future of wireless communications.

Date Posted: 2026-07-21