Process Development Engineer

Job Title

Process Development Engineer

Role Summary

The Process Development Engineer supports manufacturing and New Product Introduction (NPI) for semiconductor assembly, focusing on SMT, flip-chip attach and die-attach processes. The role works with production teams, equipment vendors and engineers to maintain yields, qualify processes, and produce process documentation.

Primary duties include production support, process evaluation and improvement, operator training, and documentation generation.

Experience Level

Mid-level — Professional (typically 2+ years in a mid-to-high-volume semiconductor manufacturing environment).

Responsibilities

Key responsibilities include production support, process qualification, yield monitoring and continuous improvement.

• Support volume production and New Product Introduction (NPI) production lines.
• Support manufacturing for surface mount technology (SMT), flip-chip attach and die attach processes.
• Evaluate and qualify new equipment, materials and processes.
• Generate post-build / DFM reports and other process documentation.
• Lead 5S and process improvement initiatives to improve throughput and quality.
• Monitor product yields daily and coordinate corrective actions with engineering and production teams.
• Work with fixturing and tooling vendors to support die assembly.
• Train and support operators and technicians on equipment operation (e.g., screen printer, SPI, SMT pick-and-place, Datacon/Esec, reflow ovens and AOI).
• Document standard operating procedures and process control plans.

Requirements

Concise list of required and preferred skills, technologies and work authorization.

• Must-have: Strong semiconductor assembly experience with high-density fine-pitch components (BGA, LGA, QFN, 0201, 01005, etc.).
• Must-have: 2+ years experience in a mid-to-high-volume manufacturing environment.
• Must-have: Familiarity with IPC-A-610, statistical process control (SPC) techniques and Lean practices.
• Must-have: Experience working with solder paste, conductive epoxy, and vacuum and convection reflow processes.
• Must-have: Hands-on experience in a factory or lab environment; ability to troubleshoot equipment and process issues.
• Must-have: Good communication and computer skills.
• Nice-to-have: Programming experience (LabVIEW, Python or similar) and advanced problem-solving skills.
• Nice-to-have: Prior Lean manufacturing implementation experience.
• Position is not eligible for visa sponsorship by the company; must be authorized to work in the U.S.

Education Requirements

Bachelor's degree in Industrial, Mechanical or Electrical Engineering is cited as preferred; postgraduate degree may be accepted in lieu of industry experience. Internship or equivalent practical experience is noted as relevant. (If no degree, equivalent hands-on manufacturing experience is considered.)

About the Company

Company: Qorvo

Headquarters: Greensboro, NC, US

Qorvo supplies innovative semiconductor solutions that enhance connectivity and power for a variety of applications, including consumer electronics, automotive, and healthcare. With a focus on RF and power solutions, Qorvo combines technology leadership and global manufacturing to address complex challenges in fast-growing industries. Their commitment to excellence and innovation drives them to shape the future of wireless communications.