Principal Systems/Mechanical Design Engineer, Semiconductor

Job Title

Principal Systems/Mechanical Design Engineer, Semiconductor

Role Summary

Lead the design and integration of complex mechanical subsystems for semiconductor capital equipment across the full product lifecycle. The role focuses on subsystem architecture, mechanical/thermal/structural/fluid solutions, verification, and cross-functional customer engagement.

This is a technical leadership position that drives subsystem performance, reliability, and manufacturability while coordinating with customers, suppliers, and global engineering teams.

Experience Level

Senior — typically requires 5+ years of relevant experience in semiconductor capital equipment, wafer-fab, or advanced packaging environments.

Responsibilities

Key responsibilities include system architecture, detailed design, analysis, verification, and cross-functional leadership.

• Architect and design mechanical subsystems (robotics/mechatronics, vacuum/gas delivery, power systems, precision assemblies).
• Create detailed CAD models and engineering drawings for weldments, sheet metal, machined parts, and assemblies.
• Define and manage system/subsystem interfaces, requirements, interface control documents (ICDs), and requirements traceability.
• Establish subsystem validation strategies and verification plans; support NPI, RFQ, qualification testing, and ECOs.
• Perform structural, thermal, dynamic, vacuum, and fatigue analyses using FEA and related tools; lead risk assessments and root-cause analysis (FMEA).
• Lead cross-functional design reviews, integration, optimization, and design validation; resolve technical issues with suppliers and customers.
• Drive DFX, VAVE, Lean practices, continuous improvement, and cost/reliability trade-offs in partnership with product management and operations.
• Mentor early-career engineers and make high-impact technical decisions that influence product performance and competitiveness.
• Ensure compliance with applicable global regulatory standards and maintain accurate documentation including BOMs, specifications, test and qualification plans.

Requirements

Minimum technical skills and experience required for successful performance in this role.

• 5+ years of experience in semiconductor capital equipment, wafer-fab, or advanced packaging environments.
• Proven expertise in mechanical design, precision systems engineering, mechatronics, power systems, and fluid/vacuum systems.
• Proficiency with CAD and engineering analysis tools for FEA, structural, and thermal analysis.
• Experience with requirements decomposition, interface control, and verification planning.
• Strong communication, documentation, and cross-functional collaboration skills; experience interfacing with customers and suppliers.
• Demonstrated ability to lead design reviews, mentor engineers, and drive technical decisions.
• Willingness and ability to travel domestically and internationally up to 30%.
• Nice-to-have: hands-on prototyping experience, prior global supplier engagement, and practical experience in semiconductor mechanical system design.

Education Requirements

Bachelor's degree in mechanical engineering, systems engineering, or a related engineering field is required. A master’s degree in mechanical or systems engineering is listed as preferred.

About the Company

Company: Jabil

Headquarters: St. Petersburg, Florida, United States

Global manufacturing services and engineering company that designs and manufactures electronic components, precision mechanical systems, and provides supply-chain, NPI, and contract manufacturing solutions across industries including semiconductor, healthcare, automotive, and consumer electronics.