Principal/Staff, APTD - Advanced Packaging Wafer Level Technology Process Engineer

Job Title

Principal/Staff, APTD - Advanced Packaging Wafer Level Technology Process Engineer

Role Summary

Lead development, characterization, integration, and qualification of wafer-level advanced packaging processes to support next-generation memory and semiconductor products.

Drive technology development from concept through qualification and manufacturing transfer, working with Process Integration, Materials, Equipment, Reliability, Design, Manufacturing, and Quality teams.

Experience Level

Senior-level. This role leads technical programs and technology transfers; see Education Requirements for degree-plus-experience guidance.

Responsibilities

Accountable for technology development, equipment/materials evaluation, quality improvements, and cross-functional program execution.

• Develop and optimize wafer-level processes (wafer thinning, backside metal interconnect) and advanced assembly flows.
• Lead development and integration of hybrid bonding, thermo-compression bonding (TCB), flip-chip, and emerging packaging technologies.
• Evaluate and qualify new equipment and materials; set process parameters and integrate tools into production.
• Drive yield, reliability, and quality improvements via process control, measurement, inspection, and testing.
• Perform data analysis (SPC, DOE, defect analysis) and establish advanced controls and dashboards.
• Manage technology transfer: prepare Process Of Record (POR) and Model Of Record (MOR) documentation and support transition to high-volume manufacturing.
• Coordinate with internal and external partners to align technology strategies with business objectives.
• Integrate AI-assisted tools and insights into workflows to improve efficiency and effectiveness.

Requirements

Must-have technical skills, domain experience, and interpersonal capabilities for this role.

• Demonstrated expertise in semiconductor process development, advanced packaging, assembly, or wafer processing.
• Hands-on experience with advanced packaging technologies such as hybrid bonding, thermo-compression bonding (TCB), and flip-chip.
• Proficiency in Python, R, and SQL for statistical analysis, process modeling, and data analytics.
• Experience with Visual Basic for automation and tool integration.
• Familiarity with equipment/process control systems such as E3, FDC, and RMS.
• Strong data analytics skills to support SPC, DOE, defect analysis, and dashboarding.
• Solid understanding of process flows, interactions, and their effects on yield, performance, and reliability.
• Strong analytical problem-solving, communication, leadership, and stakeholder-management skills.
• Ability to work independently and cross-functionally in a fast-paced manufacturing environment.
• Baseline digital fluency and role-appropriate AI literacy to use AI-enabled tools responsibly.

Education Requirements

PhD with ≥3 years, Master’s with ≥5 years, or Bachelor’s with ≥7 years of relevant experience in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or a related technical field; or equivalent practical experience.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.