Principal/Staff Advanced Packaging Development Process Engineer

Job Title

Principal/Staff Advanced Packaging Development Process Engineer

Role Summary

Lead development and qualification of wafer singulation and die separation technologies for next-generation HBM and advanced packaging products. Work with cross-functional teams, equipment suppliers, and material partners to enable manufacturing readiness and technology transfer to production.

Experience Level

Senior-level role. Candidates are expected to have substantial industry experience and a track record of technical leadership in semiconductor packaging or wafer processing.

Responsibilities

Key responsibilities for this role include process development, qualification, and transfer to production.

• Develop and optimize wafer singulation and die separation methods (blade dicing, laser grooving, stealth dicing, laser full-cut, plasma dicing, etc.).
• Support wafer thinning, grinding, mounting, and handling processes for advanced packaging.
• Design and execute DOE to improve yield, quality, and process capability.
• Evaluate and qualify new dicing equipment, tooling, and materials; partner with vendors for co-development.
• Perform process characterization, defect analysis, and root-cause investigations using statistical methods.
• Drive yield improvement and troubleshooting using structured problem-solving (KT, 5-Why, 8D).
• Collaborate with Process Integration, Reliability, Equipment, and Manufacturing teams to enable development and production transfer.
• Monitor process health with SPC, FDC, JMP, and data analytics tools.
• Integrate AI-assisted tools and insights into daily work to improve efficiency and share AI-enabled improvements within scope of work.

Requirements

Must-have technical and interpersonal skills for successful performance in this role.

• Demonstrated expertise in semiconductor process development, assembly, advanced packaging, or wafer processing.
• Hands-on experience with wafer dicing, die separation, wafer thinning/grinding, or related advanced packaging technologies.
• Strong knowledge and practical use of DOE, SPC, JMP, and data analysis for process control and improvement.
• Proven problem-solving skills and experience in process optimization and yield improvement.
• Outstanding communication, leadership, and stakeholder management skills; experience working in cross-functional global teams.
• Ability to work independently and collaboratively in a fast-paced manufacturing environment.
• Baseline digital fluency and role-appropriate AI literacy to use AI-enabled tools responsibly for research, analysis, and operational tasks.

Education Requirements

PhD (with ≥3 years relevant experience), Master’s (with ≥5 years), or Bachelor’s (with ≥7 years) in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or a related technical field.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.