Principal/Senior Engineer, Advanced Package Metrology - Real-Time Defect Analysis (MRDA)

Job Title

Principal/Senior Engineer, Advanced Package Metrology - Real-Time Defect Analysis (MRDA)

Role Summary

Member of the Advanced Packaging Technology Development (APTD) team responsible for developing and enabling inspection, metrology and real-time defect analysis (RDA) techniques for advanced packaging (including HBM) and transferring solutions to manufacturing.

Work includes recipe development and optimization, equipment evaluation and strategy, cross-functional coordination with integration, assembly/test and product engineering, and driving yield and process-control improvements.

Experience Level

Senior. The posting recommends at least 2+ years of semiconductor process or equipment engineering experience; the role expects proven hands-on experience in metrology, process control or packaging-related engineering.

Responsibilities

Primary responsibilities focus on enabling metrology/RDA solutions for advanced packaging and driving process control and yield improvements.

• Develop and optimize metrology recipes and inspection methodologies for advanced packaging processes; validate in-line performance.
• Design and execute process monitoring, sampling plans, continuous improvement (CIP), SPC and OCAP strategies.
• Perform defect analysis, DOE and statistical analysis to identify root causes and recommend corrective actions.
• Manage metrology tools and own performance indicators, control plans, and readiness for production defense.
• Establish equipment evaluation criteria and long-range metrology strategy to support the packaging roadmap.
• Coordinate across Package Integration, Assembly/Fixture/Assembly Engineering, Front End Fab, Product Engineering and Global Quality for technology integration and transfer to manufacturing.
• Integrate AI-assisted tools and data-driven methods into workflows to improve inspection, analytics and decision-making while following organizational and legal guidelines.
• Prepare reports and dashboards (e.g., Power BI) to summarize recipe status, tool performance and project progress.

Requirements

Essential technical skills, tools and experience required for the role.

• Minimum 2+ years of semiconductor process or equipment engineering experience; experience in wafer bonding, plating, warpage control or packaging is preferred.
• Proficiency in Python, R and SQL for statistical analysis, process modeling and data analytics.
• Experience with Visual Basic for automation and tool integration.
• Familiarity with equipment and process-control systems such as E3, FDC and RMS.
• Strong data analytics skills to support SPC, DOE, defect analysis and dashboard creation.
• Hands-on experience with wafer/assembly tools, metrology or RDA systems.
• Ability to work under schedule pressure, prioritize tasks, and drive root-cause problem solving to closure.
• Baseline digital fluency and role-appropriate AI literacy to use AI-enabled tools responsibly for research and operational tasks.

Education Requirements

B.S., M.S. or Ph.D. (or equivalent education) in Mechanical Engineering, Chemical Engineering, Electrical Engineering, Physics or a related technical field; equivalent practical experience is acceptable.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.