Principal Product Yield Analysis Engineer

Job Title

Principal Product Yield Analysis Engineer

Role Summary

The Principal Product Yield Analysis Engineer leads failure-analysis and yield-improvement activities during product introduction for advanced memory products (including HBM). The role applies electrical and electro‑optical characterization, production data correlation, and data analytics to identify root causes of test and reliability failures and drive corrective actions across Product Engineering, Design, Test, Quality Assurance, R&D Yield Enhancement, and Manufacturing Yield teams.

The primary objective is to achieve yield and quality targets that enable rapid production ramp-up and reduced time-to-market.

Experience Level

Senior — requires 5+ years of relevant semiconductor experience following completion of degree.

Responsibilities

Key responsibilities include technical failure analysis, data-driven root cause identification, cross-functional coordination, and mentoring.

• Perform electrical and physical failure analysis and optical fault isolation (photon emission, optical probing, microprobing) to reproduce probe failures and determine root cause.
• Use EDA tools for circuit understanding, timing characterization, and failure-signature analysis; evaluate automation and ML/AI approaches to improve methodologies.
• Analyze fab and probe data (ESDA, layout/net tracing, image analysis); monitor yields, investigate SWRs/conversions/excursions, and correlate probe data with inline monitors and backend reliability data.
• Lead regular technical meetings with remote and domestic sites to present findings and recommend corrective actions.
• Mentor remote failure-analysis teams, provide first-silicon support for new products and nodes, and develop new FA techniques and shift-left strategies.

Requirements

Must-have and preferred technical qualifications.

• Must-have: 5+ years of relevant semiconductor experience; hands-on experience with electrical and physical failure analysis and optical fault isolation techniques; proficiency with probe/backend test flows and fab data analysis methodologies; strong English communication and presentation skills.
• Nice-to-have: Experience with DRAM/HBM products and 3D-integration/packaging root-cause analysis; familiarity with hybrid and 2.5D/3D EDA tools (schematic/layout/net tracing, simulation); background with sub-10nm process or optical engineering coursework; advanced programming skills (Java, C++, Python, R) and ML/AI applied to failure analysis; willingness to travel to remote manufacturing sites and additional language skills.

Education Requirements

BS, MS, or PhD in Electrical Engineering, Electronics, Photonics, Materials Science & Engineering, Applied Physics, Computer Engineering, or equivalent technical degree; or equivalent practical experience.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.