Principal Product Engineer β Digital & Signoff Group (DSG)
Product engineer on the Cadence Digital & Signoff Group (DSG) team responsible for bridging R&D, application engineering, and customers to drive adoption and improvement of physical-design and signoff tools.
The role focuses on enabling RTL-to-GDSII flows, resolving tool issues, and delivering methodology and benchmarking for advanced-node designs (7nm and below).
Senior-level. See Education Requirements for explicit years-of-experience guidance.
Primary responsibilities include technical leadership, customer support, and methodology development for advanced-node physical design and signoff.
Must-have technical skills and experience; education details are in the Education Requirements section below.
Nice-to-have:
Bachelor's in Electronics Engineering (EE) with 6+ years of industry experience, OR Master's in Electronics Engineering (EE) with 4+ years of digital implementation experience. (Source specifies EE degrees and the corresponding years of experience.)
Company: Cadence Design Systems
Headquarters: San Jose, California, USA
Cadence Design Systems is a global electronic design automation company that provides software, hardware, and intellectual property for designing advanced semiconductor chips. With over 25 years in the industry, Cadence is known for its innovative technology solutions and has been recognized by Fortune Magazine as one of the 100 Best Companies to Work For. The company is dedicated to solving complex technical challenges in order to enable customers to create revolutionary products and experiences.
