Principal Product Engineer

Job Title

Principal Product Engineer

Role Summary

Principal Product Engineer on Microsoft Silicon within Compute Silicon & Manufacturing Engineering (CSME). Responsible for product and test engineering across new chip development, bring-up, manufacturing and launch to ensure power, performance, thermal, testability and yield targets are met at scale.

The role partners with platform, system, manufacturing and vendor teams to define test strategy, implement ATE test programs, manage fusing/data flows, and drive post-silicon tuning and yield improvement.

Experience Level

Senior — Principal-level. Typical candidates have substantial product development and manufacturing experience (often 8+ years); specific degree-plus-experience combinations are listed in the Education Requirements section.

Responsibilities

Key responsibilities focus on product engineering, test development, and manufacturing readiness for large-scale silicon programs.

• Lead product/test engineering across new product development, first-silicon bring-up, and manufacturing transfer.
• Drive pre-silicon readiness and post-silicon power, performance, thermal and power-delivery testing and tuning.
• Develop and implement ATE test programs to optimize SOC power/TDP and enable binning strategies.
• Define and manage fuse requirements and end-to-end fusing data flows across test sockets and production.
• Perform test bring-up, characterization, debug, yield analysis and failure analysis to improve quality and yield.
• Lead cross-functional sub-projects, manage external vendors and supply-chain partners, and coordinate sample delivery milestones.

Requirements

Must-have technical skills and program-level responsibilities. Degree requirements are summarized separately in Education Requirements.

• Deep experience in semiconductor IC development, fabrication, testing and packaging.
• Strong knowledge of ATE test program development, test-methods, test bring-up, characterization, debug and yield analysis.
• Familiarity with DFT/DFM concepts, silicon fabrication processes, and basic transistor/device physics.
• Experience driving power/performance modeling and ATE binning optimization across pre- and post-silicon phases.
• Proven project leadership: leading cross-functional teams, managing vendors and external partners.
• Hands-on experience with bring-up/debug, qualification, SKU/configuration management and production ramp.
• Strong statistical background (DOE, probability) and experience with yield recovery strategies.
• Ability to meet Microsoft security and export-control screening requirements (background checks and documentation to assess eligibility to access export-controlled information).

Education Requirements

Degree and experience combinations accepted: Doctorate (PhD) in Electrical Engineering, Computer Engineering, Computer Science or related field with 3+ years technical engineering experience; Master’s (MS) in those fields with 6+ years; Bachelor’s (BS/BE/BTech) in those fields with 8+ years; or equivalent practical experience. Preferred experience levels are higher (e.g., PhD +5 years, MS +8 years, BS +12 years). Fields: Electrical Engineering, Computer Engineering, Computer Science or related technical disciplines. The role allows equivalent industry experience in lieu of degrees and requires documentation of citizenship or residency as part of export-control screening.

About the Company

Company: Microsoft

Headquarters: Redmond, Washington, United States

Microsoft is a global technology company that develops and sells software, services, devices, and solutions. Known for its Windows operating system, Office suite, and Azure cloud platform, Microsoft aims to empower individuals and organizations around the world to achieve more. The company fosters a culture of innovation and inclusion, focusing on delivering trusted experiences to customers and partners globally.