Principal Process Engineer, Die Bonding

Job Title

Principal Process Engineer, Die Bonding

Role Summary

As a Principal Process Engineer in Die Bonding within Advanced Packaging Technology Development, you will develop, validate, and optimize die-bonding processes and transfer them to manufacturing to improve product quality, reliability, yield, and cost.

Collaborate with R&D, equipment and material suppliers, and manufacturing teams to support new product introductions and resolve production issues.

Experience Level

Senior — requires 8+ years of semiconductor process engineering experience.

Responsibilities

Key responsibilities include:

• Develop, diagnose, and resolve die-bonding process technologies and failure modes.
• Coordinate and execute process, equipment, and material evaluation and optimization; implement changes at process steps.
• Lead continuous yield improvement, cost reduction, and productivity initiatives.
• Validate and qualify new process baselines, tools, and materials for new product introductions.
• Identify, diagnose, and resolve assembly and manufacturing line problems using failure analysis, FMEA, 8D, and SPC/FDC methodologies.
• Manage, audit, and liaise with material suppliers to meet quality, cost, and risk-management objectives.
• Support SPC/FDC/RMS/APC systems, site-to-site portability, and internal/external audits.

Requirements

Must-have skills and experience:

• 8+ years of practical semiconductor process engineering experience focused on advanced packaging/process development.
• Solid engineering knowledge of die stacking and advanced packaging processes.
• Skilled in designing valid tests and Design of Experiments (DOE).
• Strong data collection, organization, and analysis skills; proficiency with data analysis tools and techniques.
• Experience with failure analysis and statistical process control methodologies (FMEA, 8D, SPC/FDC).
• Experience managing suppliers and coordinating equipment/material evaluations.
• Excellent oral and written communication, attention to detail, and ability to work independently or lead teams.
• Familiarity with project management principles.

Nice-to-have:

• Experience with die bonding methods such as fusion, hybrid, or direct bonding and applications like MEMS, imager, memory, or heterogeneous integration.
• Experience at a vendor, research institute, or semiconductor equipment supplier/integrator.

Education Requirements

BS (Bachelor's) degree required. Preferred: Master's or Doctorate in Engineering, Physics, or a related technical field. The posting does not explicitly state an equivalent-experience alternative.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.