Principal Process Development Engineer (Wire Bond Package R&D)

Job Title

Principal Process Development Engineer (Wire Bond Package R&D)

Role Summary

The Principal Process Development Engineer will develop, optimize and transfer wire-bond semiconductor assembly processes to achieve product Functional Requirement Specifications, high yield and robust manufacturability. The role leads technical work on wire-bond and related FOL processes across project teams and sites and supports internal and external customers on process issues.

Experience Level

Senior level — requires five or more years of relevant experience in semiconductor or manufacturing environments (posting specifies at least 5 years).

Responsibilities

Key duties include process development, characterization, and technical leadership for wire-bond packaging and related FOL processes.

• Develop and characterize new semiconductor assembly processes using structured methods (DOE, SPC, FMEA, Six Sigma).
• Drive end-to-end process development from concept to stable, high-yield manufacturing solutions.
• Provide technical input on assembly processes and equipment solutions for new products and platforms.
• Lead technical troubleshooting and cross-site problem solving for wire bond and related FOL processes.
• Apply wafer metallization knowledge to improve process performance and stability.
• Perform benchmarking and technology studies to support package roadmap and continuous improvement.
• Use statistical analysis tools (e.g., Minitab/Statistica) to analyze process performance and support data-driven decisions.
• Provide technical support for wire-bond issues to internal and external customers and ensure clear technical alignment across teams.

Requirements

Must-have technical skills, experience and behavioral qualities.

• Minimum 5 years experience in semiconductor or manufacturing environments.
• Hands-on experience with FOL processes: wafer dicing, die bond, plasma, wire bond, AOI.
• Deep knowledge of wire-bond packaging technologies and process control.
• Practical experience applying Six Sigma and problem-solving methods (DOE, SPC, FMEA, 8D) and statistical tools (Minitab/Statistica).
• Strong analytical and data-interpretation skills; able to drive data-based decisions.
• Effective written and verbal communication in English; strong teamwork and cross-functional collaboration skills.
• Ownership mindset, responsiveness, and ability to handle customer or production issues effectively.
• Nice-to-have: experience with wafer metallization optimization, cross-site technical leadership, and benchmarking studies.

Education Requirements

Bachelor's degree in engineering or a related technical field, or equivalent practical experience; degree requirement may be satisfied by equivalent related experience.

About the Company

Company: Nexperia

Headquarters: Cabuyao, Philippines

Nexperia is a global leader in semiconductor development with a focus on in-house production. The company boasts a strong international network and is dedicated to innovation and excellence in the semiconductor industry, providing a dynamic environment for its employees.