Principal Process Development Engineer (Die Attach Package R&D)

Job Title

Principal Process Development Engineer (Die Attach Package R&D)

Role Summary

The Principal Process Development Engineer will lead die attach (DA) process development for semiconductor packaging in an R&D environment, driving technologies from concept toward production readiness and manufacturability.

This role works within cross-functional project teams to provide technical leadership on die attach, wafer metallization, assembly processes, and reliability of package solutions.

Experience Level

Senior — Principal-level role. Requires significant industry experience (see requirements for years guidance).

Responsibilities

Accountable for developing, characterizing, and industrializing die attach and related package processes; providing technical leadership across sites and projects.

• Develop and characterize new die attach process technologies and materials (eutectic, epoxy, DAF).
• Lead technical discussions and align die attach strategy within cross-functional project teams.
• Provide technical input for assembly processes and equipment selection for new products and platforms.
• Optimize wafer metallization and wafer-level process steps to support package performance and yield.
• Design and implement robust manufacturing solutions to ensure package reliability and process stability.
• Provide technical support for die attach issues for internal and external customers, including problem solving and corrective actions.
• Perform competitor benchmarking and technology assessments to inform package roadmaps.
• Drive cross-site process improvement and lead global technical problem-solving initiatives.

Requirements

Key technical and professional requirements. Must-haves are listed first.

Must-have:

• Minimum 5 years of experience in a semiconductor manufacturing environment.
• Hands-on experience with die attach processes such as eutectic, epoxy, and DAF.
• Strong knowledge of front-of-line (FOL) assembly processes including die bond, wire bond, and automated optical inspection (AOI).
• Experience applying Six Sigma and statistical tools (DOE, SPC, FMEA, 8D); familiarity with Minitab or Statistica.
• Strong analytical, data-driven problem-solving skills and technical troubleshooting ability.
• Effective verbal and written communication in English; ability to work in cross-functional teams and lead technical discussions.
• Ownership mentality and responsiveness to internal and external customer needs.

Nice-to-have:

• Experience with package reliability testing and manufacturing transfer to high-volume production.
• Experience coordinating cross-site engineering teams on process improvements.

Education Requirements

Bachelor's degree in engineering or a related discipline required (e.g., Electrical, Materials, Mechanical, Chemical, or similar). The posting specifies a Bachelor's degree; equivalent relevant experience in semiconductor process development may be considered where appropriate.

About the Company

Company: Nexperia

Headquarters: Cabuyao, Philippines

Nexperia is a global leader in semiconductor development with a focus on in-house production. The company boasts a strong international network and is dedicated to innovation and excellence in the semiconductor industry, providing a dynamic environment for its employees.