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Principal Physical Design Engineer

Aion Silicon
April 20, 2026
Remote
Worldwide
Level - Senior

Role Summary

The Principal Physical Design Engineer will handle the entire physical implementation process of complex System-on-Chip (SoC) or ASIC designs, overseeing everything from initial design handoff to final sign-off for manufacturing. The role demands deep expertise across the physical design flow and the ability to make significant technical decisions at the chip level.

Experience Level

Senior level with over 10 years of physical design experience.

Responsibilities

The Principal Physical Design Engineer will be responsible for:

  • Managing full-chip activities and delivering on daily tasks.
  • Mentoring and training Physical Design teams on full-chip PnR and signoff activities.
  • Coordinating with cross-functional teams to define Physical Design strategies.
  • Keeping current with engineering advances to ensure the company remains at the forefront of technology.
  • Representing the company at universities, conferences, and trade shows.

Requirements

Must-have requirements include:

  • 10+ years of physical design experience.
  • Hands-on expertise in delivering multiple Full-Chip Floorplanning & Integration.
  • Experience in advanced technology nodes (e.g., 7nm, 5nm, 3nm).
  • Strong communication and leadership skills.
  • Ability to create floorplans from chip specifications.
  • Proficiency with EDA tools such as Synopsys or Cadence.

Education Requirements

Information not specified.


About the Company

Company: Aion Silicon

Headquarters: London, United Kingdom

Aion Silicon is a global engineering firm specializing in design solutions for ASIC and SoC development. With design centers in the UK, Spain, India, and Morocco, Aion Silicon focuses on innovative digital IP designs and integrates various designs into customer projects, aiming for high quality and efficiency. They seek experienced professionals passionate about design and technology to join their team in leading projects and advancements in the semiconductor industry.

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Date Posted: 2026-04-20