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Principal Packaging Engineer

Microsoft
May 09, 2026
Full-time
Remote friendly (Redmond, Washington, United States)
United States
$139,900 - $274,800 USD yearly
Other Semiconductor Jobs, Level - Senior

Job Title

Principal Packaging Engineer

Role Summary

Principal Packaging Engineer on the Microsoft Quantum team responsible for developing and scaling packaging and assembly processes for quantum devices. The role focuses on hands-on process and materials development, supplier evaluation, and establishing robust, repeatable assembly workflows across a distributed engineering organization.

The position works closely with mechanical, electrical, and materials engineers and external vendors to adapt industry packaging approaches to the unique requirements of quantum systems.

Experience Level

Senior. Typical experience expectations align with a principal-level engineer (multi-year technical engineering experience; see Education Requirements for specific experience guidance tied to degree).

Responsibilities

Key responsibilities include process development, supplier engagement, and cross-functional collaboration to deliver scalable packaging solutions for quantum hardware.

  • Develop, document, and maintain robust assembly and packaging processes for quantum devices; implement processes across global teams.
  • Adapt industry-standard packaging materials and processes to meet quantum device requirements.
  • Drive and manage relationships with external material suppliers and packaging vendors to secure scalable solutions.
  • Evaluate suppliers and select scaling partners based on technical and supply-chain criteria.
  • Support development and integration of advanced packaging technologies into device assembly workflows.
  • Collaborate with cross-functional teams (engineering, science, manufacturing) and work independently when required.
  • Maintain documentation, process controls, and knowledge transfer to distributed teams.

Requirements

Must-have technical skills and constraints to perform the role; preferred items are listed separately.

  • Hands-on experience with packaging process and materials development for complex hardware assemblies.
  • Proven ability to create and scale repeatable assembly processes and documentation for global teams.
  • Experience evaluating and working with external suppliers and contract manufacturers.
  • Ability to meet specialized security screening and export-control requirements, including citizenship verification or permitted status for access to controlled information.
  • Ability to use AI tools for modeling, analysis, research, and task automation while following responsible-AI safeguards.

Nice-to-have:

  • Experience managing outside vendors and supplier qualification programs.
  • Familiarity with industry-standard packaging materials and processes.
  • Experience with cryogenic materials and microwave device packaging.

Education Requirements

Master's Degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field plus 7+ years technical engineering experience; OR Bachelor's Degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field plus 8+ years technical engineering experience; OR equivalent practical experience.


About the Company

Company: Microsoft

Headquarters: Redmond, Washington, United States

Microsoft is a global technology company that develops and sells software, services, devices, and solutions. Known for its Windows operating system, Office suite, and Azure cloud platform, Microsoft aims to empower individuals and organizations around the world to achieve more. The company fosters a culture of innovation and inclusion, focusing on delivering trusted experiences to customers and partners globally.

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Date Posted: 2026-05-08