Principal Package Engineer

Job Title

Principal Package Engineer

Role Summary

Join Microsoft SCHIE (Silicon, Cloud Hardware, and Infrastructure Engineering) within Compute Silicon & Manufacturing Engineering (CSME) to lead selection, qualification, and manufacturing of advanced semiconductor packaging solutions supporting Azure datacenter products.

The role partners with silicon architects, platform teams, suppliers, and manufacturing to define packaging technology, validate designs, and drive reliability and quality from development through production.

Experience Level

Senior. Typical experience expectations: mid-to-late career (commonly 8+ years with a relevant Bachelor's; preferred candidates have 15+ years of hands-on semiconductor package design/manufacturing experience).

Responsibilities

Key responsibilities include technical leadership across packaging design, qualification, supplier engagement, and cross-functional delivery.

• Define and drive optimal package solutions (including BGA, 2.5D, 3D and chiplet architectures) to meet product roadmap requirements.
• Lead design and development of bridge/interposer/substrate and package assembly drawings from definition to tapeout and production.
• Develop and execute test vehicle strategies to validate silicon, package, and system performance.
• Assess and qualify suppliers (OSATs, foundries), manage supplier development and production readiness.
• Perform and deliver FMEA and reliability characterization for IC packages; translate FEA and simulation results into design requirements and risk mitigations.
• Define EDA tool requirements and apply 2D/3D extraction and simulation tools for power, signal, and thermal analysis.
• Drive cross-functional engineering decisions across product lines, working with motherboard, thermal, power, and performance engineers.
• Ensure manufacturability, quality, and reliability objectives are met during manufacturing bring-up and ramp.

Requirements

Must-have technical skills, experience, and compliance requirements.

• Extensive experience in semiconductor package design, development, and manufacturing, including advanced packaging technologies (BGA, 2.5D, 3D).
• Hands-on experience with package assembly drawings, substrate design support, and tapeout flows.
• Experience defining and executing test vehicle strategies and FMEA for package technologies.
• Proven supplier assessment, OSAT/foundry interaction, and subcontract supplier management experience.
• Working knowledge of high-speed signaling, electrical/layout/thermal/mechanical co-design and related simulation tools; experience with thermo-mechanical FEA.
• Experience in physical failure analysis and translating validation data into engineering decisions.
• Ability to lead cross-functional teams and communicate trade-offs across silicon, platform, and supply chain stakeholders.
• Willingness and ability to meet Microsoft security screening and export-control eligibility requirements.

Education Requirements

Degree and equivalent experience combinations are acceptable: Doctorate (EE, CE, CS, Physics or related) plus 3+ years; Master’s (EE, CE, CS or related) plus 6+ years; Bachelor’s (EE, CE, CS or related) plus 8+ years; or equivalent practical experience. Preferred listings note advanced degrees and higher years (e.g., Doctorate +5 years, Master’s +8 years, Bachelor’s +12 years) in Electrical Engineering, Computer Engineering, Computer Science, Physics, or related technical fields.

About the Company

Company: Microsoft

Headquarters: Redmond, Washington, United States

Microsoft is a global technology company that develops and sells software, services, devices, and solutions. Known for its Windows operating system, Office suite, and Azure cloud platform, Microsoft aims to empower individuals and organizations around the world to achieve more. The company fosters a culture of innovation and inclusion, focusing on delivering trusted experiences to customers and partners globally.