Principal Package Design Engineer – R&D (Discrete / Power)
NexperiaJob Title
Principal Package Design Engineer – R&D (Discrete / Power)
Role Summary
Lead package design activities for discrete and power semiconductor packages across new product introduction (NPI) and mass production phases. Work within the R&D/package engineering team and with cross-functional stakeholders to produce manufacturable, reliable, and cost-competitive lead-frame assemblies aligned with industry and internal standards.
Experience Level
Senior — Principal level role. Requires a minimum of 6+ years of relevant experience in lead frame design, semiconductor packaging design, or equivalent industrial experience.
Responsibilities
Primary responsibilities include design, technical specification, manufacturability, and continuous improvement of lead-frame based semiconductor packages.
- Lead and support lead-frame package design for NPI and mass production, ensuring functional and manufacturing requirements are met.
- Collaborate with Package Architects to develop and finalize technical assembly drawings and design specifications.
- Define dimensions and tolerances based on assembly capability, package technology, and lead-frame fabrication rules.
- Ensure compliance with industry standards (e.g., JEDEC) and automotive quality standards where applicable.
- Apply knowledge of assembly processes including die attach, wire bonding (gold/copper/silver), and molding/encapsulation.
- Specify and evaluate lead-frame materials, surface finishes/platings (Ag, NiPdAu, Sn) to ensure reliability and solderability.
- Support evaluation of high-precision metal manufacturing processes such as progressive die stamping and chemical etching.
- Identify cost-reduction opportunities and lead initiatives to improve package competitiveness.
- Perform statistical and failure analysis, structured problem-solving, and technical reporting to support decisions.
- Contribute to technical documentation, papers, and intellectual property generation.
Requirements
Core technical skills and experience required for successful performance in this role.
- Minimum 6+ years experience in lead-frame design, semiconductor packaging design, or closely related fields.
- Strong knowledge of semiconductor assembly processes and packaging technologies (die attach, wire bonding, molding).
- Experience with lead-frame materials, plating technologies, and manufacturing process considerations.
- Proficiency in AutoCAD and SolidWorks.
- Familiarity with statistical tools and methodologies such as Minitab, DOE, FMEA, and technical reporting practices.
- Strong verbal and written communication skills in English and good documentation/reporting discipline.
- Ability to work independently and collaboratively in cross-functional teams; self-motivated and adaptable.
- Analytical problem-solving skills and experience performing failure analysis and structured investigations.
- Nice-to-have: experience with automotive standards (AEC-Q100/Q101), progressive stamping process optimization, and prior IP or technical paper contributions.
Education Requirements
Bachelor's or master’s degree in Mechanical, Electronics, Manufacturing Engineering, or a related engineering discipline.
About the Company
Company: Nexperia
Headquarters: Cabuyao, Philippines
Nexperia is a global leader in semiconductor development with a focus on in-house production. The company boasts a strong international network and is dedicated to innovation and excellence in the semiconductor industry, providing a dynamic environment for its employees.
