Principal Optical Packaging Engineer
MicrosoftJob Title
Principal Optical Packaging Engineer
Role Summary
Join a multidisciplinary Microsoft Research team working at the intersection of optics, photonics, electronics, packaging, networking, and AI system design. The role focuses on developing scalable, manufacturable packaging solutions to integrate photonic devices with electronic ICs for co-packaged optics and next-generation AI infrastructure.
Work closely with internal R&D and Azure product teams and Tier‑1 partners to move prototypes toward production; role is primarily based in the United Kingdom with a hybrid on-site requirement (3 days per week).
Experience Level
Senior / Principal level. Specific years of experience not stated; role requires proven industry expertise in advanced and optical packaging.
Responsibilities
Lead technical design, prototyping, and transfer of co‑packaged optics and advanced packaging solutions.
- Architect and co‑design packaging for co‑packaged optics, integrating photonic devices, ASICs, and interposers.
- Define and prototype advanced packaging solutions (2.5D/3D integration approaches, fiber attach, optical coupling, thermal management).
- Develop scalable optical assembly and alignment strategies, balancing tolerances and manufacturability.
- Co‑optimize packaging with photonics, electronics, and system teams for signal integrity, power delivery, and thermal performance.
- Engage with Tier‑1 suppliers and manufacturing partners to drive technology transfer and production readiness.
- Build, validate, and iterate prototypes; identify failure modes and refine designs based on measurements and system constraints.
Requirements
Must-have technical skills and professional capabilities.
- Proven industry experience in wafer/panel level and advanced packaging with a strong focus on optical packaging and co‑packaged optics.
- Hands‑on experience in optical module or CPO packaging design.
- Practical experience with fiber attach and optical coupling techniques.
- Experience with high‑speed interconnect packaging and signal integrity considerations.
- Strong understanding of system‑level trade‑offs across electrical, optical, thermal, and mechanical domains.
- Ability to operate effectively in multi‑disciplinary teams and communicate technical results clearly in English.
- Nice-to-have: experience with advanced semiconductor packaging (FCBGA, 2.5D/3D integration), familiarity with hyperscale data center interconnect requirements, and experience working with external manufacturing partners.
Education Requirements
Master's or PhD in Electrical Engineering, Photonics, Materials Science, or a related technical field.
About the Company
Company: Microsoft
Headquarters: Redmond, Washington, United States
Microsoft is a global technology company that develops and sells software, services, devices, and solutions. Known for its Windows operating system, Office suite, and Azure cloud platform, Microsoft aims to empower individuals and organizations around the world to achieve more. The company fosters a culture of innovation and inclusion, focusing on delivering trusted experiences to customers and partners globally.
