Principal Module and FA Lead

Job Title

Principal Module and FA Lead

Role Summary

This role owns module integration and system-level failure analysis across mechanical, electrical, thermal, firmware, and optical/photonics domains during pre-production and early-volume phases. The role coordinates cross-functional teams to diagnose multi-domain failures, establish integration procedures and KPIs with NPI, and ensure clean handoffs as products transition to contract-manufacturing volume.

Experience Level

Senior — expects approximately BS +15 / MS +12 / PhD +9 years in hardware failure analysis, systems engineering, or related root-cause engineering roles.

Responsibilities

Primary responsibilities include:

• Serve as the focal point for module integration and system-level failure triage across multiple engineering domains.
• Own system-level integration to ensure mechanical, electrical, thermal, firmware, and optical subsystems meet specification and resolve integration-stage issues (fit, interfaces, tolerance stack-up, cross-domain interactions).
• Establish module integration procedures, entry/exit criteria, integration test flow, and KPIs with the NPI team, and ensure those carry forward at handoff.
• Coordinate with design engineers to evaluate system-level trade-offs and diagnostics that guide failure analysis and debugging.
• Lead structured root-cause investigations using fishbone analysis and staged, resource-aware design of experiments to triage candidate variables.
• Perform data analysis to verify hypotheses, drive countermeasures to closure, and ensure findings convert into actual design or process changes.
• Develop and own FA documentation and trend-tracking systems from scratch.
• Define and maintain clear handoff criteria to NPI as products transition to CM-driven high-volume manufacturing.

Requirements

Must-have:

• Proven experience leading cross-domain root-cause investigations on coupled, multi-variable failure modes.
• Technical fluency across mechanical, electrical, thermal, and firmware domains; comfortable interfacing with photonics/optical teams.
• Hands-on practice running test and measurement setups and following repeatable, structured problem-solving methods under pressure.
• Practical experience designing and prioritizing design-of-experiments under constraints (limited samples, long test cycles).
• Ability to build quick first-principles models (thermal, electrical, mechanical) to narrow hypotheses before physical testing.
• Track record of closing the loop from root cause to engineering change or process change, and standing up processes/infrastructure in early-stage environments.
• Strong cross-functional communication and leadership to convene the correct teams and drive resolution to implemented changes.

Nice-to-have:

• Direct photonics/optical packaging experience (fiber coupling, wire-bond/die-attach, epoxy/encapsulation).
• Pragmatic judgment on depth vs. speed and a collaborative, root-cause-first mindset.

Education Requirements

Bachelor's, Master's, or PhD in Electrical Engineering, Mechanical Engineering, Physics/Applied Physics, Materials Science, Optical Engineering, or a related technical field; or equivalent practical experience. Experience guidance from the posting: BS +15 years, MS +12 years, PhD +9 years. For PhD candidates the posting expects post-degree industry experience spanning multiple engineering domains rather than solely academic research.

About the Company

Company: Xscape Photonics

Headquarters: Santa Clara, California, United States

Developer of integrated photonics solutions and instrumentation, specializing in photonic circuits, control systems, and test methodologies for optical communication and sensing applications. Works on device integration, control algorithms, and validation of photonic hardware and firmware.