Principal Mixed-Signal ASIC Engineer

Job Title

Principal Mixed-Signal ASIC Engineer

Role Summary

Lead development of mixed-signal ASICs for silicon photonic systems, driving designs from concept through production. The role sets ASIC strategy, establishes design flows and tools, and builds a small team of analog and digital IC designers.

Experience Level

Senior - typically 7+ years of relevant analog and mixed-signal IC design experience.

Responsibilities

Accountable for end-to-end mixed-signal ASIC development and team leadership.

• Drive analog tapeouts from concept to production across technology nodes (including 130 nm and below).
• Design ultra-low-noise transimpedance amplifiers (TIAs) and other precision analog circuits.
• Develop mixed-signal blocks: amplifiers, ADCs, DACs, bias and power-management circuits that interface with photonic ICs.
• Establish the ASIC development environment: select EDA tools, define design flows, and set verification standards.
• Collaborate with photonics designers, systems engineers, and FPGA/digital teams for co-design and integration.
• Provide HDL and architectural specifications to external digital design partners.
• Hire, mentor, and lead a small team of analog and digital IC designers.

Requirements

Core technical and delivery requirements (must-have vs nice-to-have).

Must-have:

• 7+ years of analog and mixed-signal IC design experience with an ~80/20 analog-to-digital focus.
• Proven record leading multiple tapeouts from concept to production silicon.
• Deep expertise in low-noise analog design, specifically TIAs or similar precision circuits.
• Experience developing test plans for analog ASICs and coordinating with OSAT/test partners.
• Strong understanding of mixed-signal design: ADCs, DACs, bias circuits, and power management.
• Experience working with mature process nodes and interfacing with advanced-node digital design.
• Track record of delivering working silicon within 9–12 months and effective cross-team communication.

Nice-to-have:

• Experience with photonic IC co-design or interfacing analog circuitry with optical components.
• Familiarity with advanced packaging (chiplets, heterogeneous integration, 2.5D/3D) and design-for-manufacturability.
• Experience selecting EDA tools, defining flows, and engaging with commercial IP ecosystems and license negotiations.
• Background in advanced packaging, heterogeneous integration, or system-level integration with photonics.

Education Requirements

Not specified.

About the Company

Company: Voyant Photonics

Headquarters: New York, NY, USA

New York City–based company developing compact silicon photonic LiDAR sensors that measure range, velocity, and reflectivity with high accuracy. Uses fingertip-scale silicon photonic chips to produce affordable, high-performance sensors for robotics, autonomous vehicles, drones, industrial automation, and other sensing applications.