Principal Mechanical Architect

Job Title

Principal Mechanical Architect

Role Summary

Lead mechanical architecture and system design for next-generation semiconductor wafer probing and test platforms. Serve as the senior technical owner for precision motion, wafer handling, chuck systems, and integrated automation across multidisciplinary product teams.

Collaborate with Controls, Electrical, Software, Optical, Automation, Product Engineering, and Manufacturing to deliver solutions that meet accuracy, repeatability, thermal stability, throughput, reliability, and scalability requirements.

Experience Level

Senior-level. Principal / senior technical contributor role.

Responsibilities

Accountable for system-level mechanical architecture, design leadership, and cross-functional technical direction:

• Define and own mechanical architecture for wafer-probing/test systems and integrated automation platforms.
• Architect precision motion and positioning solutions (X/Y/Z/θ stages, actuators, encoders, guide systems, flexures).
• Design wafer handling, support, alignment, chucking, and vacuum/thermal management systems.
• Lead structural, thermal, modal and FEA analysis to resolve vibration, stiffness, and thermal issues.
• Integrate mechanical, electrical, sensors, and controls; collaborate with Controls to optimize closed-loop performance.
• Drive prototype validation, qualification, NPI, production ramp, and supplier integration.
• Investigate and resolve complex field and production issues; support customer installations and factory acceptance testing.
• Provide technical mentorship, set engineering standards, and influence long-term product architecture.

Requirements

Must-have skills, technical expertise, and experience for success in the role:

• Demonstrated expertise in precision motion systems, positioning stages, linear/servo motors, air bearings, and encoder technologies.
• Experience designing or specifying wafer chuck systems, alignment methods, and chuck-control concepts.
• Strong background in mechanical dynamics, vibration control, stiffness/tolerance analysis, and thermal-mechanical behavior.
• Proven ability to perform or specify FEA, modal analysis, and thermal simulation.
• Experience integrating mechanical subsystems with controls, sensors, and software in complex electromechanical platforms.
• Familiarity with SolidWorks, Creo, MATLAB/Simulink, FEA or equivalent engineering tools.
• Proven track record of leading complex engineering projects and influencing cross-disciplinary technical decisions.
• Customer-facing experience supporting installation, qualification, and production ramp preferred.

Education Requirements

Minimum of a Bachelor’s degree (with ~5 years related experience), or a Master’s degree (~3 years), or a PhD (no minimum experience); equivalent practical work experience accepted. No specific field of study was specified in the posting.

About the Company

Company: FormFactor

Headquarters: Livermore, California, United States

FormFactor provides test and measurement technologies and services for the semiconductor industry across the product lifecycle — including characterization, modeling, reliability, design debug, qualification and production test. The company serves customers globally through facilities in Asia, Europe, and North America.