Principal Laminate Substrate Development Engineer
QorvoJob Title
Principal Laminate Substrate Development Engineer
Role Summary
Lead development and qualification of high-density interconnect laminate substrates (mSAP) for RF semiconductor applications. The role partners with global design teams and external suppliers to define technology roadmaps, drive material and process development, and enable high-volume manufacturing.
Position is based in Seoul and reports into Qorvo’s RF Packaging Center of Excellence; requires regular collaboration with internal design teams and supplier visits.
Experience Level
Senior-level. Requires 10+ years of direct experience in PCB/mSAP laminate manufacturing and substrate development.
Responsibilities
Primary responsibilities include technical leadership for substrate technology, supplier qualification, and launch support.
- Interface between Qorvo design community and global suppliers to create and execute substrate technology roadmaps.
- Develop, qualify, and support introduction of new laminate material sets and suppliers following company processes and documentation standards.
- Design material and surface-finish evaluations using screening tests and design of experiments to improve RF performance, MSL rating, cost, or size.
- Plan, execute, and monitor complex process and product development projects using program management methodology.
- Apply structured problem-solving to resolve technology and supply-chain challenges and improve supplier capabilities.
- Provide on-site technical support at laminate suppliers for development, qualification, and issue resolution (travel required).
Requirements
Must-have:
- Extensive industry experience with laminate/PCB manufacturing, specifically mSAP Cu pattern plating, panel plating, and surface finishes.
- Recognized understanding of IPC laminate/PCB standards and design rules, manufacturing and qualification standards.
- Practical use of SPC techniques, DOE, and structured problem-solving methodologies (e.g., DMAIC, 8D).
- Knowledge of design for manufacturability and requirements for ramping technologies into high-volume manufacturing.
- Effective project management and communication skills; ability to work cross-functionally and with suppliers.
- Fluent in Korean and English.
Nice-to-have:
- Familiarity with assembly/packaging processes and materials (SMT, die attach, wire bond/flip chip, molding, multi-layer laminates).
- Established network within subcontractors and experience supporting advanced packaging technology.
- Proven track record supporting new products, processes, or technology introductions.
Education Requirements
Bachelor's degree or higher in Chemistry or an engineering discipline (electrical, materials, chemical, mechanical or related). The posting specifies "Bachelors or higher degree in Chemistry or Engineering disciplines."
About the Company
Company: Qorvo
Headquarters: Greensboro, NC, US
Qorvo supplies innovative semiconductor solutions that enhance connectivity and power for a variety of applications, including consumer electronics, automotive, and healthcare. With a focus on RF and power solutions, Qorvo combines technology leadership and global manufacturing to address complex challenges in fast-growing industries. Their commitment to excellence and innovation drives them to shape the future of wireless communications.
