Principal IC Substrate Development Engineer

Job Title

Principal IC Substrate Development Engineer

Role Summary

Lead development of high-density interconnect substrates and mSAP laminate solutions for RF semiconductor products. Work with internal design teams and global suppliers to create and qualify substrate technologies from concept through high-volume manufacturing.

Position is based in Seoul, Korea and reports to Qorvo's RF Packaging Center of Excellence (Greensboro, NC). The role requires technical leadership, supplier engagement, and cross-functional collaboration.

Experience Level

Senior — 10+ years of direct experience in PCB/mSAP laminate manufacturing and development.

Responsibilities

Primary responsibilities include technical development, supplier qualification, and program execution to support next-generation RF packaging.

• Interface between internal design teams and global suppliers to define substrate technology roadmaps.
• Develop, qualify, and support production launch of new laminate materials and suppliers following company processes and documentation standards.
• Design material and surface-finish evaluations using screening tests and design of experiments to improve RF performance, reliability (MSL), cost, or size.
• Plan, execute, and monitor complex process and product development projects using program management methodology.
• Apply structured problem-solving (SPC, DOE, DMAIC, 8D) to resolve development or supply-chain issues.
• Provide on-site technical support at laminate suppliers for development, qualification, and problem resolution (travel required).

Requirements

Must-have technical skills, experience, and attributes.

• Demonstrated experience with mSAP laminate fabrication for RF applications and high-density interconnect substrates.
• Hands-on knowledge of laminate/PCB manufacturing processes (e.g., Cu pattern plating, panel plating, surface finishes).
• Strong understanding of IPC laminate/PCB standards, design rules, manufacturing and qualification practices.
• Experience using SPC techniques, DOE, and structured problem-solving methodologies (e.g., DMAIC, 8D).
• Design for Manufacturability understanding and experience ramping technologies into high-volume manufacturing.
• Effective project management skills and ability to coordinate cross-functional teams.
• Established network with subcontractors/suppliers for advanced packaging technology.
• Proven track record supporting new products, processes, or technology through packaging solutions.
• Fluent in Korean and English.

Nice-to-have:

• Familiarity with assembly and packaging processes such as SMT, die attach, wire bond/flip chip, molding, and multi-layer laminates.

Education Requirements

Bachelor's degree or higher in Chemistry or Engineering disciplines.

About the Company

Company: Qorvo

Headquarters: Greensboro, NC, US

Qorvo supplies innovative semiconductor solutions that enhance connectivity and power for a variety of applications, including consumer electronics, automotive, and healthcare. With a focus on RF and power solutions, Qorvo combines technology leadership and global manufacturing to address complex challenges in fast-growing industries. Their commitment to excellence and innovation drives them to shape the future of wireless communications.