Principal Firmware Developer, HBM

Job Title

Principal Firmware Developer, HBM

Role Summary

Lead firmware development for next-generation High Bandwidth Memory (HBM) products. Work on embedded firmware, driver layers, verification and production firmware while collaborating with firmware architects, SoC design and verification teams, and customers to deliver robust, scalable firmware solutions.

Experience Level

Senior - 10+ years of relevant engineering or design engineering experience.

Responsibilities

The role covers architecture review, implementation, validation, and cross-functional coordination from concept through product sustainment.

• Analyze firmware, design, and customer requirements and create implementation plans.
• Design and deliver firmware across driver layers, design verification, manufacturing/test, and production firmware.
• Use FPGA prototyping to develop and validate firmware implementations.
• Collaborate with architecture, RTL design, verification, and IP teams to co-optimize firmware and hardware interfaces.
• Provide technical leadership through silicon bring-up, qualification, customer enablement, and product sustainment.
• Drive technical discussions with internal and external collaborators to align requirements and features.
• Support silicon debug, validation, diagnostics, and reliability workflows.
• Apply AI-assisted development tools to improve engineering workflows.

Requirements

Must-have technical skills and domain experience.

• Strong embedded systems/firmware development experience, including low-level programming and system control.
• Proven ability to architect complex firmware systems and system-level enablement features for large-scale GPU/CPU/TPU environments.
• Background in memory technologies (DRAM, HBM, NAND) and subsystem architectures.
• Hands-on experience with hardware bring-up, silicon debug, and production firmware support.
• Experience with RAS, diagnostics, telemetry, testing, or reliability-focused firmware.
• Familiarity with high-speed interfaces and protocols, memory controllers, PHY interaction, and SoC-level firmware integration.
• Experience working in multi-functional silicon development teams and collaborating across hardware, firmware, and architecture groups.
• Understanding of DRAM operation and JEDEC standards (HBM preferred) and exposure to AI/ML workloads and datacenter-scale memory systems.
• Proficiency applying AI-enabled development workflows.

Education Requirements

Bachelor of Science in Electrical Engineering (BSEE) or greater is specified.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.