Principal Engineer, Thermo-Mechanical

Job Title

Principal Engineer, Thermo-Mechanical

Role Summary

Lead development and qualification of thermal and thermo-mechanical technologies for advanced semiconductor packaging within the Advanced Packaging Technology Development team. The role drives thermal architecture, simulation methodologies, cooling solution evaluation, and cross-functional technology decisions to support AI, cloud, networking, silicon photonics, and co-packaged optics products.

This position frequently interfaces with product engineering, package architects, reliability, OSAT partners, suppliers, and customers and may require eligibility to access export-controlled technology.

Experience Level

Senior (Principal) level. Requires approximately 10+ years of relevant thermal, thermo-mechanical, advanced packaging, or semiconductor technology development experience.

Responsibilities

Technical leadership and execution to develop thermal solutions and ensure package readiness across product programs.

• Lead development of thermal and thermo‑mechanical technologies for advanced packaging platforms.
• Define thermal architecture requirements and technology strategies for future AI, networking, silicon photonics, and co‑packaged optics products.
• Develop and evaluate advanced cooling solutions: TIMs, vapor chambers, liquid cooling, cold plates, immersion and package‑integrated cooling.
• Perform thermal, structural, and thermo‑mechanical analysis and establish simulation methodologies for package development.
• Correlate simulation models with laboratory measurements, package characterization, and reliability data to improve predictive accuracy.
• Investigate failure mechanisms (warpage, stress, deformation, delamination, fatigue, material degradation) and provide mitigation guidance.
• Drive technology selection, design tradeoff analysis, and technical decision‑making across multiple product programs.
• Collaborate with OSATs, suppliers, cooling vendors, product engineers, and reliability teams to develop and qualify new technologies.
• Mentor engineers and develop thermal design practices, simulation workflows, and engineering standards.
• Represent the company in technical engagements with customers, suppliers, and industry partners as needed.

Requirements

Key skills and experience required for immediate contribution.

Must-have:

• 10+ years of thermal, thermo‑mechanical, advanced packaging, or semiconductor technology development experience.
• Proven leadership developing thermal and thermo‑mechanical solutions for advanced semiconductor packages and heterogeneous integration platforms.
• Deep knowledge of heat transfer, structural mechanics, material behavior, package reliability, and failure mechanisms.
• Experience with advanced cooling technologies (TIMs, vapor chambers, liquid cooling, cold plates, immersion, package‑integrated cooling).
• Extensive experience with thermal and thermo‑mechanical simulation tools such as ANSYS Mechanical, Icepak, Fluent, Abaqus, COMSOL, or equivalent.
• Proven ability to correlate simulations with laboratory measurements, package characterization, and reliability data.
• Experience driving technology development with OSATs, material suppliers, and cooling vendors, and working with cross‑functional engineering teams.
• Strong written and verbal communication skills and the ability to influence technical decisions.

Nice-to-have:

• Experience supporting AI accelerators, networking products, silicon photonics, or co‑packaged optics.
• Familiarity with advanced packaging technologies (2.5D/3D integration, chiplets, heterogeneous integration, hybrid bonding, advanced substrates).
• Experience developing thermal design methodologies, design rules, or technology roadmaps.
• Direct customer engagement to evaluate thermal requirements and solutions; record of publications, patents, or industry leadership.

Education Requirements

M.S. or Ph.D. in Mechanical Engineering, Materials Science, Engineering Mechanics, or a related engineering discipline (as stated in the posting).

About the Company

Company: Marvell Technology

Headquarters: Santa Clara, California, United States

Marvell’s semiconductor solutions serve as essential building blocks of the data infrastructure connecting our world, driving innovation across enterprise, cloud, AI, and carrier architectures. The company focuses on creating transformative technology that shapes the future.