Principal Engineer, Signal and Power Integrity
QualcommJob Title
Principal Engineer, Signal and Power Integrity
Role Summary
Drive advanced package technology and package-system design for high-speed memory interfaces. Perform electrical model extraction, signal and power integrity simulation, and collaborate with package, PCB and IC designers to optimize performance, reliability, and manufacturability.
Work within a multidisciplinary packaging engineering team to define package-to-system specifications, validate models through lab correlation, and support new product introduction.
Experience Level
Senior / Principal-level engineering role. See Education Requirements for degree-to-experience mapping.
Responsibilities
Primary responsibilities focus on signal and power integrity analysis, model extraction, simulation, and documentation.
- Perform IO analyses for various memory interfaces, from model extraction through time/frequency-domain simulation and reporting.
- Analyze IO power distribution for product and reference systems using established methodologies.
- Perform package extraction for time-domain and frequency-domain analyses and provide package design guidelines.
- Collaborate with package, board, and IC designers to optimize overall package and system design.
- Validate and correlate multi-physics models with lab measurements.
- Create clear, complete documentation and present technical results to stakeholders.
Requirements
Must-have technical skills and demonstrated experience. Degree and formal education details are listed under Education Requirements.
- Proven experience in signal and power integrity analysis and electrical model extraction for packages and PCBs.
- Experience with time-domain and frequency-domain analysis workflows for package/board systems.
- Ability to produce clear technical documentation and communicate results across teams.
- Practical experience working with high-speed memory interfaces and system-level impacts.
Nice-to-have / preferred
- Experience with field solvers (HFSS, Q3D, Sentinel-PSI, Clarity) and SPICE transient simulation tools (ADS, Hspice).
- Familiarity with IBIS and IBIS-AMI models, DDR/LPDDR design specifications, and transmission line/crosstalk analysis.
- Experience automating simulation flows in Matlab; programming or scripting (C/C++, Python, Perl) is a plus.
Education Requirements
Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or a related field with approximately 8+ years of relevant system/package design or technology engineering experience; OR Master's degree in those fields with approximately 7+ years; OR PhD in those fields with approximately 6+ years. Preferred qualifications reference Master's or PhD-level candidates with additional industry experience in DDR/package-related work. (Degrees and field of study are required as listed.)
About the Company
Company: Qualcomm
Headquarters: San Diego, California, United States
Qualcomm is a global leader in semiconductor and telecommunications equipment, specializing in mobile technologies and innovations. Known for its Adreno GPUs, the company provides solutions enabling advancements in mobile gaming, AI, VR/AR, and autonomous driving. Qualcomm's cutting-edge technology and commitment to high-performance, power-efficient designs drive the evolution of mobile graphics and connectivity worldwide.
