Principal Engineer — Process Development, Thin Film (CVD/Diffusion), NAND

Job Title

Principal Engineer — Process Development, Thin Film (CVD/Diffusion), NAND

Role Summary

Provide technical leadership for NAND advanced thin films, defining direction and driving development and integration of structural and electrical film processes into manufacturing.

Lead multi-functional teams at Fab 10N/X to deliver manufacturable, scalable process modules with a focus on yield, reliability, and ramp to high-volume production.

Experience Level

Senior. See Education Requirements for degree-to-years experience mapping required for this role.

Responsibilities

Key responsibilities include development, integration, and transfer of thin film processes for advanced NAND devices.

• Define and implement technical strategy for structural and electrical film process development aligned with business and technology objectives.
• Lead cross-functional teams to develop, integrate, and scale thin film processes (CVD/ALD/Diffusion) for advanced NAND structures.
• Oversee end-to-end process module development with focus on manufacturability, scalability, integration readiness, yield, and reliability.
• Investigate and resolve complex technical issues (root cause analysis and failure mitigation).
• Drive technology transfer and ramp activities from R&D to high-volume manufacturing.
• Lead cost-reduction, yield-improvement, and reliability programs through process and materials innovations.
• Mentor senior engineers and represent the function in technical forums and strategic collaborations.
• Integrate AI-assisted tools and data-driven methods to improve efficiency and effectiveness.

Requirements

Must-have technical and interpersonal skills for successful performance.

• Proven experience in Thin Films R&D or Process Development for NAND, including CVD and diffusion thin films.
• Mastery of thin film deposition (ALD/CVD) for high-density NAND applications; process design, optimization, and integration.
• Advanced characterization and analysis skills (examples: XRR, ellipsometry, SEM, TEM, SIMS, XPS) and electrical evaluation methods (leakage, impedance, capacitance, breakdown).
• Proficiency in SPC, DOE, and data analytics for process optimization and problem solving.
• Ability to drive novel chemistries, materials, and hardware solutions (e.g., chamber design, plasma source optimization, gas delivery).
• Technical leadership through influence, strong cross-functional and cross-site collaboration, mentorship, and executive-level communication.
• Preferred: competitive benchmarking and industry trend assessment translating into actionable roadmaps.

Education Requirements

PhD with ≥5 years, Master’s with ≥7 years, or Bachelor’s with ≥10 years of relevant experience in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or a related technical field.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.