Principal Engineer, Package Silicon Integration

Job Title

Principal Engineer, Package Silicon Integration

Role Summary

Drive silicon and package integration strategies within Micron’s Package Development Engineering team. Partner with Package Design, Chip Package Interaction (CPI), Product Development Engineering, Fab Technology Integration, Substrate Technology, Program Management, and Quality & Reliability to deliver integrated package-module products.

Define CPI design guidelines and technical roadmaps, provide technical input on reliability and electrical validation, and establish monitoring approaches for silicon integration health across package components, modules, and SSD products.

Experience Level

Senior level. The posting specifies 5+ years of relevant industry experience.

Responsibilities

Key responsibilities include the following:

• Develop systems and methods to monitor end-to-end CPI (chip-package interaction) health across products and lifecycles.
• Lead and maintain CPI package design rules in the design rule management system; maintain design rule manuals for flip-chip, wire-bond, and 3DS packages.
• Create and maintain technology roadmaps and present technical status to stakeholders.
• Support CPI test vehicle development and reliability characterization efforts.
• Provide technical feedback on reliability and electrical validation plans and propose risk mitigation solutions.
• Collaborate with CPI engineering, package design, BEOL process integration, product engineering, and global quality to identify failure mechanisms and non-ideal design drivers (NUDDs).
• Use AI-enabled tools to accelerate workflows: build AI agents, compile summaries from diverse data sources, and enable data-driven decision-making.

Requirements

Must-have technical skills and experience:

• At least 5 years of relevant industry experience in package/CPI engineering or related roles.
• Experience with chip-package interactions and first-level chip interconnect reliability.
• Experience with component/package materials selection, BOM management, and package assembly processes.
• Proven ability to collaborate across multi-functional teams and influence technical decisions.
• Strong written and verbal communication skills to convey technical concepts to technical and non-technical partners.

Nice-to-have:

• Experience with NAND/DRAM memory assembly, design, and CPI failure mechanisms.
• Knowledge of DRAM/NAND fab BEOL processes and packaging interactions that affect device quality and reliability.

Education Requirements

Bachelor’s degree or higher in Materials, Mechanical, Chemical, or Electrical Engineering.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.