Principal Engineer, Package Integration and Manufacturability
NVIDIAJob Title
Principal Engineer, Package Integration and Manufacturability
Role Summary
Lead package integration and manufacturability for networking chip programs, owning package technical decisions and driving co-design between package, substrate, interposer and silicon. Identify package risks early, quantify their impact on cost, schedule and yield, and partner with advanced technology teams and external suppliers to reduce risk and improve manufacturability.
Experience Level
Senior - 15+ years of experience in package technology development or system integration.
Responsibilities
Key responsibilities include:
- Lead technical assessment of package risk across chip programs; identify failure modes in substrate, interposer and assembly integration and quantify cost/schedule impact.
- Define and drive manufacturability strategies spanning package, substrate, interposer and silicon to improve yield, capacity, testability and assembly process maturity.
- Analyze module yield mechanics, reconcile predicted vs. actual yield from assembly returns, and convert findings into concrete design guidance.
- Evaluate emerging packaging and photonics technologies, assess external partner solutions, and define product requirements with the advanced technology group.
- Represent and defend package technical positions at program and technology reviews and coordinate cross-functional execution.
Requirements
Must-have qualifications and skills:
- More than 15 years of experience in package technology development or system integration with multiple products carried through assembly.
- Deep understanding of 2.5D, chiplet and organic substrate integration.
- Working knowledge of assembly and module yield mechanics, including how alignment tolerance and process excursions affect assembly yield.
- Strong analytical skills and ability to solve demanding technical problems.
- Proven ability to drive complex, cross-functional activities and hold a technical position across organizations.
Nice-to-have:
- Hands-on experience on an assembly floor, foundry or OSAT.
- Experience with co-packaged optics, photonic packaging, or fiber and laser attach.
- Proven experience driving design-for-manufacturability into early architecture decisions and working on large high-end ASICs and multi-die modules.
Education Requirements
B.S. or M.S. in Electrical Engineering, Mechanical Engineering, Materials Science, or a related technical field, or equivalent practical experience.
About the Company
Company: NVIDIA
Headquarters: Santa Clara, California, USA
NVIDIA is a global leader in accelerated computing, renowned for its innovative solutions in AI and digital twins that transform diverse industries. The company specializes in networking technologies, providing end-to-end InfiniBand and Ethernet solutions for servers and storage that optimize performance and scalability. NVIDIA serves sectors such as high-performance computing, enterprise data centers, and cloud computing, constantly reinventing its products and services to stay ahead in the market.
