Principal Engineer - HIG HBM Layout
The Principal Engineer will lead layout design efforts for High Bandwidth Memory (HBM) products on the HIG HBM team in Hyderabad, India. The role focuses on designing complex analog/mixed-signal and custom IC layouts to meet performance, power, area, and tape-out requirements for high-performance computing and AI applications.
This position is a technical and people-lead role: you will grow and manage a layout team, define specifications, coordinate multi-site projects, and represent the team in industry standards activities.
Senior — requires extensive experience. The posting specifies 15+ years in analog/custom layout and a minimum of 4+ years developing and leading teams and projects.
Primary responsibilities include hands-on layout leadership, project delivery, and collaboration across design and customer teams.
Must-have technical skills and experience; concise summary of required qualifications.
Bachelor's (BE) or Master's (MTech) in Electronics or VLSI Engineering is specified.
Company: Micron Technology
Headquarters: Boise, Idaho, USA
Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.
