Principal Engineer - HIG HBM Layout

Job Title

Principal Engineer - HIG HBM Layout

Role Summary

Lead end-to-end layout execution and full-chip integration for High Bandwidth Memory (HBM) products, covering analog, mixed-signal, and custom digital blocks. Responsible for technical decisions impacting performance, power, and area and for driving delivery across multiple concurrent tape-outs.

Experience Level

Senior — typically 15+ years in analog/custom layout and at least 4+ years leading teams and projects.

Responsibilities

Primary responsibilities include technical leadership, hands-on layout work, and team delivery across HBM programs.

• Lead layout execution of analog, mixed-signal, and custom digital blocks and manage full-chip integration for HBM designs.
• Own full-chip technical decisions for analog, digital, memory, ESD, and EM/IR to meet PPA targets.
• Perform and oversee layout verification activities (LVS, DRC, antenna checks) and ensure documented closure.
• Plan and track project execution: area/time estimates, schedules, task delegation, and milestones.
• Drive timely delivery of block-level and full-chip layouts that meet quality and schedule commitments.
• Lead design reviews, mentor junior layout engineers, and build team capability.
• Promote automation and AI-assisted methods to reduce manual effort and improve turnaround and quality.
• Collaborate with cross-functional global teams (design, verification, IP, packaging) for alignment and integration.
• Support customer/product integration: specification alignment and design clarifications.

Requirements

Must-have technical skills and experience for immediate contribution and leadership.

• 15+ years of experience in analog/custom IC layout in advanced CMOS processes.
• Minimum 4+ years of experience developing teams and managing projects.
• Proven experience leading multiple projects and tape-outs.
• Expertise with Cadence VLE/VXL and Calibre DRC/LVS (required).
• Strong floorplanning, manual routing, and layout skills for critical blocks.
• Experience running multiple custom IC layout projects concurrently.
• Excellent verbal and written communication skills and ability to work across time zones.
• Demonstrated ability to recruit, develop, and retain a premier analog/mixed-signal layout team.
• Experience applying AI/automation to improve tools, workflows, or layout efficiency.

Education Requirements

Bachelor of Engineering (BE) or MTech in Electronics / VLSI Engineering.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.