Principal Engineer - Board/Package Co-design

Job Title

Principal Engineer - Board/Package Co-design

Role Summary

Lead PCB and silicon packaging co-design for Arm's hardware prototyping platforms. Work with SoC architects, packaging engineers, and platform teams to define technical requirements, assess trade-offs, and deliver system-level hardware architectures.

Contribute to high-performance embedded compute platforms used for prototyping Arm IP and enabling customers and development partners.

Experience Level

Senior (Principal). Posting does not specify years of experience; role requires advanced expertise in SoC, board design, and package co-design.

Responsibilities

Deliver practical board and package co-design solutions and coordinate cross-functional technical decisions.

• Specify, evaluate, and develop PCB and silicon package integration strategies with global engineering teams.
• Drive PCB development: breakout planning, routing strategies, design rules, and layer-stack optimization.
• Assess package pinout options for routability, SI/PI performance, layer count, manufacturability, and cost.
• Perform escape routing analysis and estimate routable IO counts for target stack-ups and design rules.
• Define PCB layout guidelines and collaborate with fabricators and CEM partners on manufacturability.
• Support early silicon and board architecture definition: placement, form-factor constraints, PDN strategy, and routing feasibility.
• Translate technology requirements into platform architectures and provide timescale estimates to program teams.
• Communicate technical decisions clearly to audiences from packaging and silicon architecture to platform leads.

Requirements

Must-have technical skills and experience.

• Deep understanding of SoC architectures and platforms for high-performance embedded compute, cloud/edge AI, and IoT.
• Experience with high-speed interfaces (PCIe Gen5/6/7, LPDDR5/6, CSI, DSI) and embedded storage/compute peripherals.
• Proven embedded system board design experience with complex LSI devices (e.g., FPGAs), PMICs, and firmware interactions.
• Familiarity with IC packaging technologies and their impact on PCB design; experience collaborating with chip packaging teams.
• Extensive knowledge of Signal and Power Integrity analysis from board and packaging perspectives.
• Knowledge of PCB fabrication processes, stack-ups, VIA topologies, HDI, and substrate materials.
• Proficiency with EDA tools for schematic entry and PCB layout (Cadence OrCAD & Allegro).
• Ability to work in a fast-paced environment, manage changing priorities, and drive progress with attention to detail.

Nice-to-have:

• Experience with SI tools (ANSYS, Siemens EDA) and semiconductor industry background.
• Familiarity with compute architecture building blocks and working across global teams.

Education Requirements

Not specified.

About the Company

Company: Arm

Headquarters: Cambridge, United Kingdom

ARM is a global leader in semiconductor and software design, driving innovation in computing technology. The company specializes in designing processors and systems that provide the essential building blocks for electronic devices. ARM's architecture is widely used in smartphones, servers, and IoT devices, and its collaborative culture fosters bold thinking, diversity, and high-impact benefits for its talented workforce.