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Principal EDA R&D Engineer, Advanced Packaging

Synopsys
August 11, 2026
Full-time
On-site
Austin, Texas, United States
$166,000 - $249,000 USD yearly
EDA Jobs, Level - Senior

Job Title

Principal EDA R&D Engineer, Advanced Packaging

Role Summary

Lead research and development of EDA tools for package substrate design, driving technical direction and delivering production-grade automation for advanced packaging technologies.

Work with cross-functional teams and external partners (foundries, OSATs) to translate manufacturing requirements into scalable tooling and database architectures.

Experience Level

Senior β€” typically 10+ years of EDA software development experience focused on physical design automation, package or substrate design.

Responsibilities

Primary responsibilities include leading technical projects, designing algorithms, and mentoring engineers.

  • Lead R&D projects for substrate design automation: auto-routing, DRC engines, PDN analysis, and design-for-manufacturing capabilities.
  • Define and drive database models that support schematic-driven layout workflows and tool integration across the packaging suite.
  • Design and implement scalable EDA software and algorithms using C++, Python, and TCL; optimize for production-scale designs.
  • Translate Design Rule Manuals and manufacturing requirements from foundries and OSATs into tool requirements and implementations.
  • Specify and integrate input/output formats and manufacturing handoff (e.g., ODB++) into product flows.
  • Provide technical guidance and code reviews; mentor less-experienced engineers on architectural tradeoffs and implementation quality.
  • Engage with customers and senior technical stakeholders to represent product capabilities and influence roadmap decisions.

Requirements

Must-have technical skills and experience. Equivalent practical experience acceptable where noted.

  • 10+ years of EDA software development experience with emphasis on physical design automation, package design, or substrate design.
  • Deep expertise in package substrate physical design methodologies: schematic-driven layout, auto-routing, DRC, and power delivery network analysis.
  • Strong programming skills in C++; proficiency in Python and TCL for integration and automation.
  • Proven track record leading R&D projects that delivered production software or major architectural improvements.
  • Experience working with foundries, OSATs, or substrate manufacturers on technology files, design rule manuals, and manufacturing output formats such as ODB++.
  • Solid foundation in computational geometry and algorithm design for layout automation; experience with constraint-based routing or placement is highly valued.
  • Effective communicator able to discuss technical tradeoffs with senior engineering and manufacturing partners; demonstrated mentorship ability.

Education Requirements

Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, Computer Science, or equivalent practical experience in EDA or semiconductor design.


About the Company

Company: Synopsys

Headquarters: Mountain View, California, USA

Synopsys is a leading company in electronic design automation (EDA) and semiconductor IP solutions. It provides tools and services for designing and verifying complex semiconductor devices and systems. The company plays a pivotal role in the semiconductor industry, helping engineers innovate and deliver higher-quality products faster. Synopsys is committed to advancing technology standards and offers a range of software and hardware solutions to its clients globally.

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Date Posted: 2026-08-09