Principal Design Engineer - IP Office
MicrosoftJob Title
Principal Design Engineer - IP Office
Role Summary
Principal engineer on Microsoft’s AI System on Chip (AISoC) silicon team responsible for IP selection, quality assurance, integration, and release processes for SoC components. Works across architecture, front-end, physical design, DFT, and post-silicon teams to ensure robust IP integration into AI SoCs.
Experience Level
Senior - expected senior-level engineering leadership and technical ownership. See Education Requirements for degree/years combinations used to assess experience.
Responsibilities
Work as an integral member of the AI SoC design team to select, validate, and integrate third-party and internal IP into SoCs.
- Identify and evaluate best-in-class IP (e.g., PLL, DTS, droop detector, HBM4, 224G Ethernet, GPIOs) and recommend IPs for target SoC landing zones.
- Define and maintain processes for IP release, update, QA, integration, and pre/post-silicon validation.
- Track IP releases and updates and manage integration timelines with design teams and vendors.
- Review IP integrations for signal and power integrity, package and board implications with internal experts and vendors.
- Collaborate closely with logic design, physical design, architecture, DFT, and system teams to optimize trade-offs.
- Provide technical leadership, mentorship, and cross-team coordination for IP office functions.
Requirements
Must-have technical capabilities, security clearance readiness, and integration experience. Preferred items listed where applicable.
- Proven experience interacting with major IP suppliers and managing IP selection, QA, and release processes.
- Experience integrating IPs into CPU, GPU, or AI accelerator SoCs and coordinating with major IP vendors.
- Hands-on knowledge of SRAM, register files, memory compilers, high-speed serial/parallel IOs, and SoC subsystem integration.
- Track record of tape-outs in deep sub-micron technologies and practical front-end and back-end IP integration flows.
- Familiarity with high-speed interfaces (e.g., 112G/224G Ethernet, PCIe 5/6, HBM3/4) and corresponding supplier ecosystems.
- Scripting skills (Python or Perl) for automation and tooling.
- Strong communication, self-motivation, and ability to collaborate across architecture, design, physical design, and post-silicon teams.
- Ability to pass Microsoft Cloud Background Check and meet export-control and security screening requirements; candidates must be able to provide proof of citizenship or lawful residency as required for access to export-controlled information.
Education Requirements
Doctorate (PhD) in Electrical Engineering, Computer Engineering, Computer Science, or related field with 3+ years technical experience; OR Master’s degree in those fields with 6+ years; OR Bachelor’s degree in those fields with 8+ years; OR equivalent practical experience.
About the Company
Company: Microsoft
Headquarters: Redmond, Washington, United States
Microsoft is a global technology company that develops and sells software, services, devices, and solutions. Known for its Windows operating system, Office suite, and Azure cloud platform, Microsoft aims to empower individuals and organizations around the world to achieve more. The company fosters a culture of innovation and inclusion, focusing on delivering trusted experiences to customers and partners globally.
