Principal 3D-Heterogeneous Integration Engineer

Job Title

Principal 3D-Heterogeneous Integration Engineer

Role Summary

Lead advanced 3D heterogeneous integration (3D-HI) research and development in the Advanced Packaging Lab to enable multi-die stacking, fine-pitch hybrid bonding, and other wafer/die-level integration technologies across product lines.

Work cross-functionally with process, manufacturing, tooling and material vendors, and external partners to drive process development, integration, and early prototyping.

Experience Level

Senior / Principal level. The role expects multiple years of industry R&D or process-integration experience (guidance in source: MS + ~4–5 years; PhD preferred).

Responsibilities

Primary responsibilities include leading process development, integration, and collaboration to deliver 3D and 2.5D heterogeneous integration solutions.

• Drive 3D-HI process development for multi-die stacking, die-to-wafer and wafer-to-wafer fine-pitch hybrid bonding, TSVs, and related building blocks.
• Plan and execute end-to-end process integration and early product prototyping across programs.
• Partner with unit process and manufacturing engineers and collaborate with tool and material vendors and OSAT partners.
• Lead joint development projects to create wafer-level and die-level integration processes.
• Use characterization resources, analyze data, interpret results, and identify failure modes.
• Identify and resolve process integration and manufacturing transfer issues.
• Generate intellectual property related to wafer integration and packaging technology.
• Mentor new hires and participate in hiring and team development activities.
• Perform duties in compliance with Environmental, Health, Safety & Security requirements.

Requirements

Key technical skills and professional expectations (must-have vs nice-to-have are noted where possible).

• Must-have: in-depth knowledge of BEOL processes and integration, advanced bonding, bump/wafer finish integration, wafer test/probe, and package development & assembly.
• Must-have: experience with multi-die stacking, TSVs, and fine-pitch hybrid bonding process flows.
• Must-have: strong problem-solving and technical troubleshooting skills, including design of experiments (DOE).
• Must-have: experience in data analysis, failure-mode analysis, and translating results into process improvements.
• Must-have: ability to coordinate with tool and material vendors, manufacturing engineers, and external partners (OSATs).
• Must-have: ability to drive cross-functional projects and integrate new processes into production environments.
• Nice-to-have: prior leadership experience with internal teams or within an OSAT ecosystem.
• Nice-to-have: project management experience; demonstrated ability to navigate ambiguity and execute solutions.
• Nice-to-have: strong written and verbal communication, planning, and organizational skills.
• Language: English fluency for written and verbal communication.
• Travel: up to 10%.

Education Requirements

Required: Master’s degree (MS) in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science or a related field from an accredited program; source expects MS plus approximately 4–5 years of related work experience and a minimum overall GPA of 3.0. Preferred: PhD (preferred) with ~2–3 years of related experience. "Related field" language included in source.

About the Company

Company: GlobalFoundries

Headquarters: Saratoga Springs, New York, USA

GlobalFoundries is a leading contract manufacturer for the global semiconductor industry, with facilities in multiple countries, including the USA. The company develops a broad portfolio of semiconductor technologies and employs around 13,000 people worldwide. GlobalFoundries focuses on enhancing competitiveness in specialized application solutions and fostering innovation in mobile communications, consumer electronics, and automotive applications.