PIC Test Lead

Job Title

PIC Test Lead

Role Summary

Lead the wafer-level optical and electrical test strategy for photonic integrated circuits (PICs), owning test architecture and execution from first-silicon bring-up through high-volume manufacturing.

Work closely with design, process integration, foundries, and manufacturing partners to define scalable probe solutions, yield-learning processes, and factory-ready test flows.

Experience Level

Senior level — requires 10+ years of experience in PIC test engineering, wafer-level probing, or photonics manufacturing test.

Responsibilities

Primary responsibilities include defining test strategy, enabling first-silicon bring-up, and driving factory scale-up and yield improvement.

• Define and own wafer-level PIC test roadmap across product lines and technology platforms.
• Architect high-throughput optical + electrical wafer probe solutions balancing alignment, stability, and test time.
• Establish release criteria, guard-banding, and wafer test coverage models aligned with product requirements.
• Lead first-silicon bring-up: test content definition, limit setting, and characterization flows.
• Drive rapid yield-learning loops with design, process integration, and fabrication teams.
• Influence PIC DFT and PDK structures to add on-chip monitors, loopbacks, test waveguides, and calibration features.
• Own wafer-level yield, parametric distributions, spatial analytics, and root-cause investigations.
• Qualify probe infrastructure with foundries/OSATs and transfer test flows into volume manufacturing with strong tool correlation.
• Serve as technical escalation point during yield crises and mentor junior engineers to standardize test practices.

Requirements

Must-have skills and experience to perform the role; preferred items listed separately.

• Must-have: 10+ years in PIC test engineering, wafer-level probing, or photonics manufacturing test with ownership of wafer-level optical/electrical test from R&D through HVM.
• Must-have: Expertise in wafer-level optical probing, probe card qualification, yield learning, spatial analysis, and test-time optimization.
• Must-have: Experience engaging foundries and driving factory transfer and qualification of probe solutions.
• Preferred: Experience with high-speed optical and electrical testing of PICs or optical transceivers.
• Preferred: Demonstrated influence on PIC DFT and collaboration with PDK teams.
• Preferred: Background in scaling test infrastructure across multiple nodes and product families in high-volume semiconductor or photonics environments.

Education Requirements

Not specified.

About the Company

Company: Xscape Photonics

Headquarters: Santa Clara, California, United States

Developer of integrated photonics solutions and instrumentation, specializing in photonic circuits, control systems, and test methodologies for optical communication and sensing applications. Works on device integration, control algorithms, and validation of photonic hardware and firmware.