Photonics Packaging Design Integration Engineer

Job Title

Photonics Packaging Design Integration Engineer

Role Summary

Lead development and sustainment of advanced optical packaging solutions for silicon photonics (SiPh) and co-packaged optics (CPO) within an advanced packaging and photonics team. Collaborate with photonics, electrical, mechanical, and manufacturing teams to deliver scalable, low-loss, and cost-effective packaging architectures that meet performance and reliability targets.

Experience Level

Senior — requires substantial industry experience; typically 15+ years of relevant engineering experience.

Responsibilities

Primary responsibilities focus on design enablement, cross-functional leadership, and ensuring manufacturable, reliable photonic packaging products.

• Drive SiPh advanced packaging product innovations and design enablement for customers and manufacturing partners.
• Support new customer products with packaging design solutions and establish technology design rules.
• Lead design reviews and coordinate cross-functional teams to resolve technical and yield issues.
• Develop analysis models to predict manufacturability, cost, and quality.
• Define electrical, photonic, and thermal requirements for chiplets and product modules; select materials and packaging architectures.
• Establish and maintain global design processes and qualification robustness.
• Implement continuous improvement plans (CIP) to meet organizational goals.
• Promote safe work practices and support Environmental, Health, Safety & Security programs.

Requirements

Must-have technical skills and experience for immediate contribution; preferred items listed separately.

• Proven experience bringing packaged products from development into production.
• Experience with electromagnetic, thermal, or packaging modeling tools (examples: HFSS, Zmax, Flotherm, or similar).
• Advanced packaging design and layout expertise, including chip-package interaction for multi-die and advanced interconnects.
• Strong written and verbal communication and demonstrated ability to lead cross-functional teams.
• Ability to create and validate complex analysis models for reliability and manufacturability.

Nice-to-have:

• Background in failure analysis, design of experiments, and packaging process integration.
• Validated record of photonic and electrical interconnect innovation and product releases.
• Deep knowledge of global technology and commercial trends in packaging and photonics.

Education Requirements

Required posting qualifications specify advanced degrees: Master of Science (MS) or Doctorate (PhD) at senior levels. Relevant fields mentioned include materials science, thermal and mechanical engineering, and simulation backgrounds. (Degrees and specific year-based expectations were presented in the original posting.)

About the Company

Company: GlobalFoundries

Headquarters: Saratoga Springs, New York, USA

GlobalFoundries is a leading contract manufacturer for the global semiconductor industry, with facilities in multiple countries, including the USA. The company develops a broad portfolio of semiconductor technologies and employs around 13,000 people worldwide. GlobalFoundries focuses on enhancing competitiveness in specialized application solutions and fostering innovation in mobile communications, consumer electronics, and automotive applications.