Photonics Integration Engineer, MTS

Job Title

Photonics Integration Engineer, MTS

Role Summary

Join the Advanced Packaging Technology Development (APTD) team to develop and integrate silicon photonics and heterogeneous integration technologies for high-performance optical connectivity. Work across device, process, packaging, and manufacturing teams to move technologies from concept to manufacturing readiness and improve development efficiency with data-driven and AI-enabled tools.

Experience Level

Mid-level to Senior - hiring across MTS, SMTS, and Principal levels. Experience guidance: PhD + >3 years industry experience; Master's or comparable experience >5 years; Bachelor's or equivalent experience >=7 years.

Responsibilities

Key responsibilities include process integration, device and package integration, and program leadership through technology transfer to manufacturing.

• Develop and optimize end-to-end process integration flows for silicon photonics from concept through manufacturing readiness.
• Lead integration and process development for photonic devices, optical interconnects, and heterogeneous integration architectures.
• Drive process characterization, DOE execution, yield improvement, defect reduction, and root-cause investigations.
• Partner with design, device, packaging, manufacturing, and suppliers to support design rule development, tapeouts, and technology transfers.
• Lead technical programs and contribute to technology roadmaps and AI-enabled engineering initiatives.
• Use data-driven approaches and statistical methods to guide process optimization and decision-making.

Requirements

Must-have technical skills and relevant experience; preferred items listed as nice-to-have.

• Must-have: Experience integrating silicon photonics processes in semiconductor development or manufacturing environments.
• Strong knowledge of semiconductor process integration, wafer fabrication, process characterization, DOE methodology, and statistical analysis.
• Experience with process flow architecture, device integration, design rule development, and tapeout execution.
• Experience driving yield improvement, defect reduction, and root-cause analysis.
• Proven ability to lead multi-functional technical projects and deliver results using data-driven methods.
• Experience collaborating across design, device, packaging, manufacturing, and supplier teams.
• Nice-to-have: Experience with III-V technologies, heterogeneous integration platforms, and advanced packaging (hybrid bonding, wafer bonding, optical interposers, co-packaged optics).
• Experience applying AI/ML, advanced analytics, or workflow automation to engineering or manufacturing problems.
• Knowledge of optical interconnect technologies for datacenter, networking, AI accelerator, HPC, or memory applications.
• Strong communication, program leadership, and project management skills.

Education Requirements

PhD in Electrical Engineering, Materials Science, Physics, Photonics, Semiconductor Engineering, or a related field preferred; or equivalent practical experience. Alternatively, a Master’s degree with relevant industry experience or a Bachelor’s degree with more extensive experience is acceptable (the posting specifies PhD + >3 years, Master’s + >5 years, or Bachelor’s + >=7 years as experience guidelines).

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.