Packaging Thermal Engineer

Job Title

Packaging Thermal Engineer

Role Summary

The Packaging Thermal Engineer performs thermal analysis, simulation, test vehicle design, and measurement correlation for advanced semiconductor packaging. This role works with internal product architects and external suppliers to assess and optimize package thermal performance.

Typical activities include CFD simulation, thermal test vehicle (TTV) design and validation, model-to-hardware correlation, and development of compact/reduced-order thermal models for package and system integration.

Experience Level

Mid-level — typically requires around 5+ years of relevant experience in packaging thermal simulation, measurement, and characterization.

Responsibilities

Key responsibilities focus on thermal test vehicle development, simulation-to-hardware correlation, and delivery of compact thermal models.

• Design and develop Thermal Test Vehicles (TTVs): define heater layouts and sensing strategies, and lead concept-to-validation execution.
• Perform CFD and thermal simulations to inform package and product thermal architecture decisions.
• Establish and execute model-to-hardware correlation methodologies; perform sensitivity studies and calibration.
• Develop compact thermal models (CTMs) or reduced-order models (ROMs) representing steady-state and dynamic behavior.
• Collaborate with internal product and system teams to customize and integrate thermal models for chip power use cases.
• Support thermal-mechanical simulation and coordinate with external suppliers for thermal performance assessment.

Requirements

Must-have technical skills and experience required for the role.

• 5+ years' experience in packaging thermal simulation analysis and measurement characterization.
• Deep expertise in heat transfer fundamentals and electronics cooling.
• Hands-on experience with CFD tools and workflows (preferably Icepak, FloTHERM) and thermal measurement techniques (thermocouples, IR, etc.).
• Experience in power-map emulation, heater design optimization, and model-to-hardware correlation workflows.
• Familiarity with packaging thermal materials (integrated heat sinks, thermal interface materials).
• Familiarity with reduced-order modelling and compact modelling techniques (RC networks, Foster models).
• Nice-to-have: thermal-mechanical simulation experience and knowledge of advanced packaging (2.5D/3D).

Education Requirements

Bachelor's or Master's degree in Mechanical Engineering or a related field with focus on packaging thermal or mechanical engineering. (The posting specifies Bachelor/Master in Mechanical Engineering or similar.)

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.