Packaging Technology Integration, Senior Staff Engineer

Job Title

Packaging Technology Integration, Senior Staff Engineer

Role Summary

Senior technical specialist responsible for end-to-end packaging technology and product integration for RF front-end modules and SiP applications. Works within a global, cross-functional engineering organization interacting with design, test, NPI, manufacturing partners, suppliers, and customers.

Main mission: develop and qualify wafer pre-assembly and package-level processes, own risk assessment and NPI to ensure robust, scalable high-volume manufacturing.

Experience Level

Senior - typically 10+ years of experience in semiconductor packaging; minimum experience requirements vary by degree (see Education Requirements).

Responsibilities

Accountable for technical leadership across packaging development, NPI, and HVM.

• Lead global cross-functional teams to drive technology readiness, execution, and product timelines.
• Develop and integrate Si and GaAs packaging processes: wafer-level interconnect, RDL, Cu-pillar/micro-bump bumping, singulation, flip-chip assembly.
• Lead and qualify wafer singulation methods (stealth dicing, plasma dicing), managing die strength, edge quality, yield, and reliability tradeoffs.
• Define substrate and assembly solutions for RF SiP and develop packaging design rules aligned with manufacturing and reliability.
• Manage upstream FAB BEOL impacts on bumping, singulation, and pre-assembly; serve as technical interface to OSATs for technology transfer and qualification.
• Drive SPC, FMEA, PCN/change control, audits, benchmarking to ensure smooth ramp and HVM stability.
• Own yield, quality, throughput, and reliability improvements; plan and execute DOE to optimize bump, die sort, yield, and CPI performance.
• Lead failure analysis, root-cause resolution, reliability learning during NPI and HVM; support customer NPQ and RMA analysis.
• Assess future 2.5D packaging technologies for feasibility, integration risks, and manufacturing readiness.

Requirements

Key technical and professional requirements (education summarized separately).

• Must-have: Extensive hands-on experience in semiconductor packaging, wafer pre-assembly/wafer BE, Cu-pillar or micro-bump bumping, wafer singulation (stealth/plasma), and die sort.
• Must-have: Demonstrated ownership across technology development, NPI, HVM, and direct customer support including NPQ/RMA work.
• Must-have: Proven ability to debug and resolve wafer-level yield, die integrity, and reliability issues affecting downstream assembly and HVM.
• Must-have: Strong understanding of packaging materials, process interactions, failure mechanisms, reliability, and qualification/testing practices.
• Must-have: Experience working with tier-1 foundries and OSATs; lead technology transfer and qualification to production.
• Must-have: Solid foundation in statistics, SPC, FMEA, and failure analysis methodologies.
• Must-have: Strong cross-functional communication, leadership skills, and ability to operate in a global matrix organization; willingness to travel internationally (~quarterly).
• Nice-to-have: Experience with RF modules / system-in-package (SiP) applications and evaluation of 2.5D packaging technologies.
• Nice-to-have: Familiarity with industry standards (IPC, JEDEC, IEEE, ISO, ANSI).

Education Requirements

Degrees and degree/experience combinations are specified. Documented options include: Bachelor's (BS/BE) in Engineering or related technical field; Master's (MS) in Mechanical, Materials, Chemical, Electrical/Electronics Engineering or related field; PhD preferred in similar fields. The posting lists multiple minimum degree+experience combinations (examples given in source): Bachelor's +6 years (one section lists Bachelor's +4 years), Master's +5 years (or +3 years in another section), PhD +4 years (or +2 years in another section). Fields explicitly mentioned: Mechanical, Materials, Chemical, Electrical/Electronics, Computer Science, and related engineering disciplines.

About the Company

Company: Qualcomm

Headquarters: San Diego, California, United States

Qualcomm is a global leader in semiconductor and telecommunications equipment, specializing in mobile technologies and innovations. Known for its Adreno GPUs, the company provides solutions enabling advancements in mobile gaming, AI, VR/AR, and autonomous driving. Qualcomm's cutting-edge technology and commitment to high-performance, power-efficient designs drive the evolution of mobile graphics and connectivity worldwide.