Packaging Module Equipment Development Engineer

Job Title

Packaging Module Equipment Development Engineer

Role Summary

Join Intel's Packaging Module Development team to develop and qualify assembly and packaging processes and equipment for advanced semiconductor products. The role is hands-on and focused on improving manufacturability, yield, reliability, and production efficiency.

Work with cross-functional teams, suppliers, and manufacturing to advance packaging technologies in an on-site lab and factory environment in the Phoenix/Chandler, AZ area.

Experience Level

Entry-level (College graduate). Relevant experience may include internships, class projects, research, military training, or paid work; preferred ~6+ months hands-on semiconductor or equipment-related experience.

Responsibilities

Key responsibilities include developing and qualifying packaging processes and equipment, characterizing process behavior, and supporting product reliability and manufacturability.

• Develop, optimize, and qualify assembly processes and hardware configurations to meet quality, reliability, cost, yield, productivity, and manufacturability targets.
• Apply Design of Experiments (DOE) and Statistical Process Control (SPC) to define process and equipment specifications and document improvements.
• Verify manufacturability of package layouts and manage end-to-end lifecycle of package processes and production flows.
• Establish material specifications and work with suppliers, procurement, and supplier quality to enforce process and qualification standards.
• Create acceleration methods, analytical tools, and quality screens to identify and mitigate packaging quality and reliability risks early.
• Define reliability requirements based on failure mechanisms and influence design, materials, and processes accordingly.
• Standardize product qualification methods and provide technical consultation to internal partners and customers.

Requirements

Must-have and preferred technical skills, excluding formal degree requirements which are listed under Education Requirements.

• Must-have: Strong analytical problem-solving and troubleshooting mindset; clear cross-functional communication; ability to drive projects from concept to production; comfortable working onsite in lab/factory environments and taking ownership of technical risk mitigation.
• Nice-to-have / Preferred: Hands-on semiconductor experience or academic research supporting manufacturing equipment (~6+ months); experience with dispense, mold, and/or cure packaging equipment technologies; experience applying SPC and DOE; familiarity with semiconductor fabrication processes, equipment sustaining, change control, or quality data systems; experience delivering complex, time-critical technical projects.

Education Requirements

Bachelor's or Master's degree in Engineering, Physics, Chemistry, or a related STEM discipline. Relevant experience may be obtained through schoolwork, classes, project work, internships, military training, or work experience.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.