Packaging Module Engineer

Job Title

Packaging Module Engineer

Role Summary

The Packaging Module Engineer designs, develops, and qualifies packaging solutions and materials to meet product, regulatory, and operational requirements. This role works with manufacturing, logistics, supply chain, and external vendors to enable safe transportation, reliability, and scale of Intel products.

Contribute to Intel's packaging solutions that support product performance, manufacturability, and sustainability.

Experience Level

Entry-level / Early career. Typical background: 0–3 years of relevant experience; examples in this posting include a Master’s degree plus 1+ year or a PhD plus 6+ months of related experience.

Responsibilities

Main responsibilities include design, qualification, and cross-functional coordination for packaging solutions:

• Design, develop, and qualify packaging materials, artwork, prototypes, and specifications.
• Lead packaging development processes from concept through qualification testing and documentation.
• Collaborate with manufacturing, logistics, regulatory, and supply chain teams to meet operational requirements.
• Evaluate and qualify vendors for packaging manufacturing startup and scalability.
• Perform risk analysis and ensure compliance with regulations and Intel quality standards.
• Identify and implement cost, waste, and efficiency improvements in packaging processes.
• Consult on labeling, SKUs, bills of material, branding, and shipment requirements.
• Benchmark designs and document technical specifications to maintain consistency.

Requirements

Key technical and professional requirements. Education requirements are summarized separately below.

Must-have:

• Experience with product packaging assembly processes and production methodologies.
• Knowledge of statistical process control (SPC) and design of experiments (DOE) techniques.
• Analytical skills for data analysis and risk assessment related to packaging.
• Design for manufacturing (DFM) practices and understanding of packaging test criteria.
• Effective communication and problem-solving skills for cross-organizational collaboration.

Nice-to-have:

• Familiarity with Surface Mount Technologies, solder joint reliability, and package certification.
• Experience leading technical teams or managing stakeholders in a matrixed environment.
• Knowledge of semiconductor device fabrication and packaging process flows.
• Proven delivery on time-critical technical projects involving innovation and strategic planning.

Education Requirements

Master's degree in Engineering, Physics, Chemistry, or a related STEM field plus 1+ years of educational or work experience; OR PhD in Engineering, Physics, Chemistry, or a related STEM field plus 6+ months of educational or work experience. (Degrees and fields explicitly stated in the posting.)

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.