Packaging Module Development Engineer

Job Title

Packaging Module Development Engineer

Role Summary

Join the Surface Mount Technology Development (SMTD) team within Intel's Assembly Technology Development (ATD) organization in Kulim. The role focuses on developing and validating SMT and PCB assembly process solutions for Intel IC packages and sockets to meet next-generation product requirements.

The engineer will drive process and materials development, failure analysis, prototype testing, and process integration with cross-functional teams to improve manufacturability, yield, and reliability.

Experience Level

Mid-level. Typical experience: 3+ years in semiconductor IC assembly or PCB SMT process development (PhD holders may qualify with 2+ years).

Responsibilities

Primary responsibilities include process development, materials evaluation, integration, and problem resolution for SMT and PCB assembly.

• Design, develop and optimize SMT processes (stencil design, solder paste selection, reflow profiling, inspection criteria).
• Characterize and select materials (solder pastes, fluxes, underfills, adhesives) for assembly performance and reliability.
• Perform root cause and failure analysis on assembly defects and implement corrective actions.
• Integrate new SMT processes into manufacturing lines and influence IC package and PCB design for manufacturability and scalability.
• Oversee prototype board assembly and testing using X-ray inspection, AOI, and other assembly equipment.
• Analyze process data with statistical tools to identify trends and drive continuous improvement.
• Create and maintain process documentation and train technicians for consistent implementation.

Requirements

Must-have technical skills and experience for immediate contribution. Nice-to-have items are listed separately.

• Must-have: Hands-on experience with semiconductor IC assembly or PCB SMT process and equipment (reflow, pick-and-place, dispensing of paste/adhesive) and an understanding of material interactions with assembly processes.
• Proficiency in statistical process tools and methods (e.g., SPC, DOE) for process control and optimization.
• Experience in failure analysis and implementing corrective actions to improve process robustness.
• Ability to collaborate with cross-functional teams to integrate processes and influence design-for-manufacturing decisions.
• Familiarity with prototype testing and inspection techniques (X-ray, AOI) and interpreting results.
• Strong written and verbal communication skills and the ability to document processes and train technicians.
• Proactive problem-solving mindset and ability to work under schedule constraints.

• Nice-to-have: Experience with high-density interconnects, miniaturization roadmap work, or advanced PCB technologies.

Education Requirements

Bachelor's, Master's or Ph.D. in Mechanical Engineering, Materials Science, Chemical Engineering, Physics, or related STEM fields. The posting specifies: Bachelor's or Master's with 3+ years' experience, or Ph.D. with 2+ years' experience.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.