Packaging Module Development Engineer
Intel CorporationJob Title
Packaging Module Development Engineer
Role Summary
Process Development Engineer responsible for developing and qualifying electronic packaging assembly processes (die/DRAM/chip attach, solder ball attach, deflux, component attach) for new products and test vehicles within Technology Development. Work includes pathfinding materials, defining process specifications, performing experiments, and preparing technologies for transfer to high-volume manufacturing.
Experience Level
Mid-level. The role expects demonstrated process or development experience (typically more than 2 years) in electronic packaging or related fields.
Responsibilities
Key responsibilities include:
- Develop and optimize solder ball attach, chip attach, deflux and related electronic packaging assembly processes.
- Design and execute experiments (DOE), analyze data, and apply SPC to drive process improvements.
- Characterize materials and processes, identify failure modes, and recommend mitigations.
- Pathfind, develop, qualify and ramp materials and processes for transfer to high-volume manufacturing.
- Document process specifications and technical improvements; produce white papers and technical reports.
- Collaborate with cross-functional teams to integrate material technologies into test vehicles and products and assess performance.
- Support yield, quality, reliability, cost and manufacturability optimization efforts.
Requirements
Must-have technical skills and experience:
- More than 2 years' experience in electronic packaging and/or process development, or demonstrated equivalent practical experience in packaging process work.
- Hands-on process engineering experience with design of experiments (DOE), statistical process control (SPC) and FMEA.
- Experience in materials characterization, process optimization, failure analysis and data-driven problem solving.
- Practical experience with chip attach, ball attach or deflux process steps preferred.
- Strong data analysis capabilities and structured problem-solving skills.
- Excellent written and verbal communication and influencing skills; able to document technical results clearly.
- Ability to work proactively under tight timelines and perform under pressure.
Education Requirements
BEng, MEng, MSc or PhD in Mechanical, Materials, Chemical, Electrical, Physics, Mechatronics or related engineering/technical disciplines. MSc/PhD and research & development background are preferred; the role is also open to fresh graduates with strong academic results.
About the Company
Company: Intel Corporation
Headquarters: Santa Clara, California, USA
Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.
